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Post-Molding Marking System (Carrier-Type + Stack/Slot Loading/Unloading)
This system is designed for marking post-packaging products. It supports both slot magazine and stack magazine loading/unloading methods and can be configured into 1-in-1-out or 2-in-2-out models according to customer process requirements.
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FC Product On-Boat Marking System (Slot Loading/Unloading)
This fully automatic equipment is designed for advanced packaging processes, suitable for marking FCBGA substrates on components such as the ring, heat spreader (electroplated type), and silicon. It supports customizable text formats including QR codes, c
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IC in Tray Marking System (Tray Loading/Unloading)
Designed for single IC package products, this machine offers precise positioning and features self-inspection capabilities. Optional pick-and-place functionality can be configured according to customer requirements.
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Board Edge 2D Marking System
This system is used for engraving 2D IDs on strips and lead frame substrates to facilitate traceability throughout subsequent processing steps.
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Tab-lead Laser Die-cutting and Cutting Integrated system
This equipment is used for slitting battery electrode sheets with tabs after die-cutting.
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Wafer Laser Grooving System
The AS-5380 uses a high quality light beam to perform surface scribing and grooving in the wafer dicing channel.
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Roll-to-Roll Thin Film Laser Etching System
This device realizes laser roll-to-roll processing, capable of etching, cutting, marking, and other functions.
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CO2 Laser Ceramic Scribing System
This system is primarily used for laser scribing of ceramic substrates in the DBC (Direct Bond Copper) industry.
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