
Glass Wafers Laser-Induced Dicing System
Uses visible or infrared laser for stealth dicing of transparent materials like coated glass and ordinary glass.
Inquiry Phone:+86-400 8017 001
E-mail:contact@delphilaser.com■ Specifications
◆ Laser type: DPSS picosecond laser (532nm & 1064nm)
◆ Laser power: ≥5W
◆ Cooling method: Closed-loop water cooling
◆ X-axis: 300mm travel length, 0.1μm resolution
◆ Y-axis: 280mm travel length, 0.1μm resolution
◆ Z-axis: 5mm travel length, 1μm resolution
◆ θ-axis: 120° travel angle, 0.001° resolution
◆ Maximum cutting thickness: 1.2mm
◆ Automatic loading and unloading of workpiece
◆ Cutting speed: 0-800mm/s
◆ Cutting chipping: <20μm
◆ Micro cracks in the cutting section: <10μm
■ Applications
For the straight-line cutting of coated glass (filters) used in the camera industry.
Suitable for the straight-line processing of ordinary glass or transparent materials with a thickness of up to 1mm, applicable in the electronics, medical, and display industries.
■ Samples

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