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The new solution of Micro LED + silicon carbide empowers new development in the industry. Delphi Laser debuted at the 8th International Forum on Wide Bandgap Semiconductors with blockbuster new products

2023-02-17 15:31:58

The 8th International Forum on Wide Bandgap Semiconductors and China Advanced Semiconductor Technology and Application Show kicked off in Suzhou on February 7. Delphi Laser was invited to make a grand appearance with its new Micro LED and silicon carbide solutions, which were widely concerned and highly praised both inside and outside the industry.

Site of China Advanced Semiconductor Technology and Application Show



 ▼ Micro LED laser solutions▼

Micro LED wafer laser mass transfer system

Model:LUT-800



 Advantages




√High yield

√High efficiency

√Fully automatic three-color loading and unloading



 Application



Laser mass transfer is used in the new display industry to transfer three-color chips to the substrate through direct transfer/secondary transfer.



Micro LED Wafer Laser Lift Off System

Model:LLO-8600



 Advantages




√High yield

√High efficiency

√Full-surface /selective lift-off



 Application



Applied to Micro LED wafer lift-off


Micro LED wafer laser repair system

Model:LTM-8810



 Advantages




√High yield

√High efficiency



 Application



Applied to laser repairing of Micro LED wafer




▼ Silicon carbide laser solutions▼


Silicon carbide wafer laser processing system

Model:DLDS-8680



Advantages




√Low material loss

√High processing efficiency

√No consumables are required to operate the equipment

√Low processing cost



Application



Applied to wafer slicing processing of silicon carbide ingots (pieces)


Laser annealing system for silicon carbide wafer

Model:LAN-6281


Application


Applied to silicon carbide wafer


 Laser-Induced Dicing System for Silicon Carbide Wafers

Model:Inducer-5560


Advantages




√High quality effect

√Fast cutting speeds

√High yield rates



Application



Wafer cutting of microwave devices and power devices used in the aerospace, power electronics and other industries (wafer with silicon carbide substrate).





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