IC in Tray Marking System (Tray Loading/Unloading)
Designed for single IC package products, this machine offers precise positioning and features self-inspection capabilities. Optional pick-and-place functionality can be configured according to customer requirements.
Inquiry Phone：+86-400 8017 001
E-mail：contact@delphilaser.com■ Specifications
Equipment Capabilities | IC in Tray Marking |
Product Compatibility | L：322.6mm |
Loading/Unloading Method | JEDEC Tray |
Laser Type | GR(ns) |
Equipment Accuracy | ±75μm |
Footprint(mm) | 2,500 * 1,100 * 2,000 |
Equipment Weight(Kg) | 2,000 |
■ Samples
For more information
