Wafer-Level Laser Micro-Drilling System（TGV）
This fully automated laser system is designed for Through-Glass Via (TGV) microhole processing on wafer-level glass substrates of various materials with thicknesses ranging from 0.1 to 1 mm. It supports the fabrication of various via structures, including blind holes and conical through-holes.
Inquiry Phone：+86-400 8017 001
E-mail：contact@delphilaser.com■ Specifications:
Materials | Fused silica, AF32, etc. |
Minimum Hole Diameter | 5 μm (on quartz glass, 200–300 μm thickness) |
Processing Accuracy | ±5μm，CPK＞1.33 |
Processing Speed | Up to 5000 vias per second |
Supported Wafer Sizes | 6”&8” |
Laser Type | IR femtosecond laser |
Loading Module | Bare wafer Load Port*1 |
Communication Protocol | SECS/GEM |
■ Samples：
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