High-Precision Laser Mesh Screen Etching System
This system is primarily used for drilling and cutting materials like PI (polyimide). It can achieve photovoltaic and non-photovoltaic processing of PI mesh screen, and can also be used for current-stage SE mesh screen and meshless screen, and other related processing.
Inquiry Phone：+86-400 8017 001
E-mail：contact@delphilaser.com■ Specifications
Model | ASP-6483-Q | ASP-6483-QZ | ASP-6483-D |
Functions | Single wire drawing | PI etching | integrated PI etching and wire drawing |
Applicable Products | 356&450 | 356&450 | 356&450 |
Positioning Accuracy | ±2μm | ±1μm | ±1μm |
Repeatability | ±1μm | ±0.75μm | ±0.75μm |
Machine Dimensions | 1400×1600×1900mm | 1670×2010×1910mm | 1670×2010×1910mm |
■ Advantages
◆ Equipped with a self-developed ultraviolet picosecond laser source
◆ Scribing taper is 6 ± 1 μm; the less adhesive used, the smaller the taper — with 5 μm adhesive thickness, the taper can reach as low as 4 μm
◆ Layered energy control process ensures no scratches on the steel wire surface and excellent ink permeability
■ Applications
Used for line pattern etching on both solar and non-solar screen-printing meshes.
■ Samples
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