With the explosive rise of large AI models, demand for optical transceivers has surged. As core data-transmission components in AI intelligent computing centers, optical transceivers 

evolve in lockstep with the advancement of computing power. As AI computing demand grows exponentially, high-speed optical modules—serving as the “critical conduit” for data 

transmission—are experiencing a rapid market boom. In the ongoing evolution of optical-module manufacturing toward higher density, higher precision, and lower cost, laser micromachining 

technologies are playing an irreplaceable role.

Breakthroughs in Optical Communication Technologies Strengthen the Foundation for AI Computing Power and Optoelectronic Integration

Recognizing the long-term growth potential of the optical-transceiver market, Delphi Laser entered the field in 2019 by developing laser-based manufacturing equipment. After years of 

technological accumulation, the company now provides customers in the optical-communication industry with a comprehensive portfolio of solutions—including laser cutting, drilling, 

depaneling, etching, solder-ball placement, welding, and bonding—along with automated dispensing & assembly, sorting, AOI inspection, and testing systems. These solutions play a critical 

role in the production of high-speed optical modules.

Laser Micromachining Solutions

In the manufacturing of 800G and 1.6T high-speed optical modules, Delphi Laser’s micromachining solutions enable high-precision fabrication of key components, ensuring high yield and 

high-density interconnects. This enhances the performance of optical-interconnect devices from the source and significantly improves optical-signal coupling efficiency and transmission quality.

· Laser bonding systems target the wire-bonding process within optical modules, using high-precision, low-stress laser-interconnect methods to improve connection reliability and high-speed 

electrical-signal integrity.

· Laser solder-ball welding and ball-mounting equipment enable electrical interconnection between chips (such as BGA or CSP) and PCBs. Through precise solder-ball placement and controlled 

reflow, the equipment forms reliable joints, achieving both mechanical attachment and electrical conduction between chip and PCB pads.

· Laser depaneling systems deliver ultra-high positional accuracy, narrow cutting kerfs, and burr- and dust-free processing, minimizing mechanical stress and providing a strong foundation for 

automated downstream assembly.

· Laser cutting systems leverage non-contact processing to avoid internal stress in components, resulting in smoother edges, higher precision, and better yield. They are suitable for materials 

such as glass, ceramics, and optical fiber.

Automation Solutions

· Multi-station automated assembly solutions enable highly efficient integration and flexible manufacturing across the optical-module production process.

· Automated chip-sorting solutions ensure accuracy and consistency in chip screening and packaging.

· Automated AOI inspection systems integrate optical detection with intelligent recognition to conduct comprehensive defect screening.

· Automated testing equipment performs fast and thorough performance verification of finished modules.

By integrating raw-material preparation, precision machining, intelligent assembly, chip sorting, defect inspection, and performance testing into a unified closed-loop system, Delphi Laser ensures 

that high-speed optical modules maintain exceptional quality and stability even under large-scale production.

Looking ahead, as demand for high-speed optical modules continues to accelerate, Delphi Laser’s full-industry-chain solutions will remain a strong enabler of AI computing power development.