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Processing

LCD Terminal Cutting System
Model：
This system is mainly used for terminal cutting of LCD products.
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Silicon Carbide Wafer Laser Cutting Systerm
Model：Inducer-5560
Uses ultra-short pulse laser to achieve high quality and high efficient cutting of silicon carbide wafer.
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UV Picosecond Laser Micromachining System
Model：DPS15/21/22/31
This system is specifically developed for cutting and engraving LCP/MPI/COF/COP/PI/CPI materials and adhesive products.
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Tab-lead Laser Die-cutting and Cutting Integrated system
Model：
This equipment is used for slitting battery electrode sheets with tabs after die-cutting.
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Wafer Laser Grooving System
Model：AS-5380
The AS-5380 uses a high quality light beam to perform surface scribing and grooving in the wafer dicing channel.
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Roll-to-Roll Thin Film Laser Etching System
Model：Etching/Cutting
This device realizes laser roll-to-roll processing, capable of etching, cutting, marking, and other functions.
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CO2 Laser Ceramic Scribing System
Model：CPP12/21/30
This system is primarily used for laser scribing of ceramic substrates in the DBC (Direct Bond Copper) industry.
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Fiber Laser Ceramic Cutting System
Model：RPP05/12/15/20/22
This system is primarily used for cutting and drilling ceramic substrates in high-power electronics modules, aerospace, military electronics, and related products.
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