EN / CN

Home>Products>Processing>Laser Cutting

Processing

Ultrafast Pulsed Laser Five-Axis Micro/Nano Machining system
Model：LMS10
The equipment achieves three-dimensional precision micro machining of various inclined surfaces, conical surfaces, and spherical surfaces through precise control of a multidimensional micro-displacement system.
More +

UV Nanosecond Laser Cutting System
Model：FPS15/21/22/30
This system is primarily designed for cutting and opening FPC and PCB boards. It excels in applications such as camera modules and fingerprint recognition.
More +

Glass Wafers Laser-Induced Dicing System
Model：Inducer-5080P
Uses visible or infrared laser for stealth dicing of transparent materials like coated glass and ordinary glass.
More +

Wireless Charging Laser Cutting System
Model：FPS15/30/21/22
This system uses high-energy green laser to efficiently cut ferrite and other materials used in wireless charging. The cut edges are smooth and burr-free, with no blackening, and the process is highly efficient.
More +

Wafer Laser Stress-Induced Dicing system
Model：Inducer-mini800
This system uses stress-induced cutting technology to process and cut Mini LED wafers.
More +

Fully Automatic Flexible OLED Contour Cutting System
Model：
This system is primarily used for precision finishing of AMOLED module segments, utilizing integrated laser cutting of OLED panels to enhance edge precision and achieve contour cutting.
More +

Fully Automatic Glass Laser Chamfering System
Model：AGC39
This system is mainly used for chamfering and shaping hard screens such as LCDs, LTPS, and OLEDs.
More +