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Micro LED Wafer Laser Mass Transfer System
Laser mass transfer is used in the new display industry to transfer three-color chips to the substrate through direct transfer/secondary transfer.
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Wafer-Level Laser Micro-Drilling System（TGV）
This fully automated laser system is designed for Through-Glass Via (TGV) microhole processing on wafer-level glass substrates of various materials with thicknesses ranging from 0.1 to 1 mm. It supports the fabrication of various via structures, including
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Post-Molding Marking System(Rail-Type + Stack/Slot Loading/Unloading)
The Fully Automatic Laser Marking Machine is designed for marking post-packaging products. It supports both slot magazine and stack magazine loading/unloading methods. Based on customer process requirements, the machine can be configured in 1-in-1-out or
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Silicon Carbide Wafer Laser Processing System
The system is used for laser slicing processing of silicon carbide ingots/pieces.
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Micro LED Wafer Laser Lift Off System
The system uses laser lift-off technology to peel off micro-LED wafers.
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Silicon Carbide Wafer Laser Cutting Systerm
Uses ultra-short pulse laser to achieve high quality and high efficient cutting of silicon carbide wafer.
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Post-Molding Marking System (Carrier-Type + Stack/Slot Loading/Unloading)
This system is designed for marking post-packaging products. It supports both slot magazine and stack magazine loading/unloading methods and can be configured into 1-in-1-out or 2-in-2-out models according to customer process requirements.
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FC Product On-Boat Marking System (Slot Loading/Unloading)
This fully automatic equipment is designed for advanced packaging processes, suitable for marking FCBGA substrates on components such as the ring, heat spreader (electroplated type), and silicon. It supports customizable text formats including QR codes, c
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