EN / CN

Home>Products>Applications>Semiconductor

Applications

IC in Tray Marking System (Tray Loading/Unloading)
Designed for single IC package products, this machine offers precise positioning and features self-inspection capabilities. Optional pick-and-place functionality can be configured according to customer requirements.
More +

Board Edge 2D Marking System
This system is used for engraving 2D IDs on strips and lead frame substrates to facilitate traceability throughout subsequent processing steps.
More +

Wafer Laser Grooving System
The AS-5380 uses a high quality light beam to perform surface scribing and grooving in the wafer dicing channel.
More +

Glass Wafers Laser-Induced Dicing System
Uses visible or infrared laser for stealth dicing of transparent materials like coated glass and ordinary glass.
More +

Wafer Laser Stress-Induced Dicing system
This system uses stress-induced cutting technology to process and cut Mini LED wafers.
More +