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Materials

Board Edge 2D Marking System
This system is used for engraving 2D IDs on strips and lead frame substrates to facilitate traceability throughout subsequent processing steps.
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Wafer Laser Grooving System
The AS-5380 uses a high quality light beam to perform surface scribing and grooving in the wafer dicing channel.
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Ultrafast Pulsed Laser Five-Axis Micro/Nano Machining system
The equipment achieves three-dimensional precision micro machining of various inclined surfaces, conical surfaces, and spherical surfaces through precise control of a multidimensional micro-displacement system.
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Wafer Laser Stress-Induced Dicing system
This system uses stress-induced cutting technology to process and cut Mini LED wafers.
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