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Busbar Laser Removal System
This system is designed for battery pack rework and second-life (cascade utilization) processes, specifically for disassembling and separating welded tab sheets.
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Metal Hinge Laser Welding System
This system provides high welding precision and quality. It supports the welding of various materials such as metals and alloys, allowing for much more choices of hinge materials.
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Femtosecond Five-Axis (Galvo) Laser Precision Machining system
This equipment utilizes a high-precision nanometer-level air-bearing platform, combined with a five-axis galvo optical module and a self-developed laser processing system. It achieves ultra-high precision cutting, drilling, and other processes. The taper
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Wafer Laser Grooving System
The AS-5380 uses a high quality light beam to perform surface scribing and grooving in the wafer dicing channel.
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Fiber Laser Ceramic Cutting System
This system is primarily used for cutting and drilling ceramic substrates in high-power electronics modules, aerospace, military electronics, and related products.
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Ultrafast Pulsed Laser Five-Axis Micro/Nano Machining system
The equipment achieves three-dimensional precision micro machining of various inclined surfaces, conical surfaces, and spherical surfaces through precise control of a multidimensional micro-displacement system.
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