2025-11
With the explosive rise of large AI models, demand for optical transceivers has surged. As core data-transmission components in AI intelligent computing centers, optical transceivers evolve in lockstep with the advancement of computing power. As AI computing demand grows exponentially, high-speed optical modules—serving as the “critical conduit” for data transmission—are experiencing a rapid market boom. In the ongoing evolution of optical-module manufacturing toward higher density, higher precision, and lower cost, laser micromachining technologies are playing an irreplaceable role. Breakthroughs in Optical Communication Technologies Strengthen the Foundation for AI Computing Power and Optoelectronic Integration Recognizing the long-term growth potential of the optical-transceiver market, Delphi Laser entered the field in 2019 by developing laser-based manufacturing equipment. After years of technological accumulation, the company now provides customers in the optical-communication industry with a comprehensive portfolio of solutions—including laser cutting, drilling, depaneling, etching, solder-ball placement, welding, and bonding—along with automated dispensing & assembly, sorting, AOI inspection, and testing systems. These solutions play a critical role in the production of high-speed optical modules. Laser Micromachining Solutions In the manufacturing of 800G and 1.6T high-speed optical modules, Delphi Laser’s micromachining solutions enable high-precision fabrication of key components, ensuring high yield and high-density interconnects. This enhances the performance of optical-interconnect devices from the source and significantly improves optical-signal coupling efficiency and transmission quality. · Laser bonding systems target the wire-bonding process within optical modules, using high-precision, low-stress laser-interconnect methods to improve connection reliability and high-speed electrical-signal integrity. · Laser solder-ball welding and ball-mounting equipment enable electrical interconnection between chips (such as BGA or CSP) and PCBs. Through precise solder-ball placement and controlled reflow, the equipment forms reliable joints, achieving both mechanical attachment and electrical conduction between chip and PCB pads. · Laser depaneling systems deliver ultra-high positional accuracy, narrow cutting kerfs, and burr- and dust-free processing, minimizing mechanical stress and providing a strong foundation for automated downstream assembly. · Laser cutting systems leverage non-contact processing to avoid internal stress in components, resulting in smoother edges, higher precision, and better yield. They are suitable for materials such as glass, ceramics, and optical fiber. Automation Solutions · Multi-station automated assembly solutions enable highly efficient integration and flexible manufacturing across the optical-module production process. · Automated chip-sorting solutions ensure accuracy and consistency in chip screening and packaging. · Automated AOI inspection systems integrate optical detection with intelligent recognition to conduct comprehensive defect screening. · Automated testing equipment performs fast and thorough performance verification of finished modules. By integrating raw-material preparation, precision machining, intelligent assembly, chip sorting, defect inspection, and performance testing into a unified closed-loop system, Delphi Laser ensures that high-speed optical modules maintain exceptional quality and stability even under large-scale production. Looking ahead, as demand for high-speed optical modules continues to accelerate, Delphi Laser’s full-industry-chain solutions will remain a strong enabler of AI computing power development.
2025-11
Twenty years of perseverance through challenges, moving forward with determination; Twenty years of growth and achievement, illuminating a brilliant journey. In 2025, Delphi Laser reached the significant milestone of its 20th anniversary. From the first faint light in the laboratory to the brilliance of industrial application, Delphi Laser has remained true to its belief in “focusing on precision and driving continuous innovation.” With craftsmanship shaping quality and innovation lighting the way, we illuminate an intelligent future. Over the past two decades, we have lit dreams with light, traced the contours of our times with lasers, and written a magnificent chapter belonging to Dephi Laser through perseverance and dedication. On the occasion of this 20th anniversary, we celebrate with a grand series of Delphi Laser 20th Anniversary events, looking back on our journey, honoring those who strive, celebrating our achievements, and embarking on a new chapter ahead. 20th Anniversary Celebration · Marathon Carnival 20th Anniversary Celebration · Honor Gala Speeches by Mr. Masataka Uchida, President of UITech, and keynote address by Dr. ZHAO Yuxing, Founder of the Company The Power of Role Models Employee Stories New Journey Kick-off Ceremony Employees' Passionate Creations 20th Anniversary Celebration · Gala Dinner Employee-produced and performed programs Speeches by Mr. Chen Honglong, Guest, and Dr. ZHAO Yuxing, Company Founder Twenty years of accumulation reflect the strength of staying true to our original aspiration; twenty years of breakthroughs testify to the power of continuous innovation. From an early-stage pioneer at its founding to today’s industry-leading intelligent manufacturing innovator, Delphi Laser has always moved forward with the spirit of a true striver. Standing at a new starting point, the people of Delphi Laser will continue to uphold the mission of “Lasers are creating a micro world.” With technology as our wings and dreams as our steed, we ride forward with unstoppable momentum toward an even more brilliant future.
2025-09
On September 26, the “All-Solid-State Battery Intelligent Manufacturing Seminar,” organized by the China All-Solid-State Battery Industry-Academia-Research Collaborative Innovation Platform, was held in Beijing. The seminar focused on innovative breakthroughs in intelligent manufacturing for all-solid-state batteries. Delphi Laser’s Chairman Dr. Zhao Yuxing and the General Manager of the Lithium Battery Division Mr. Xu Haibin were invited to attend and deliver keynote presentations. Academician Ouyang Minggao, Professor at Tsinghua University and Chairman of the Collaborative Innovation Platform Dr. Zhao Yuxing, Chairman of Delphi Laser, delivering remarks Mr. Xu Haibin, General Manager of Delphi Laser’s Lithium Battery Division, presenting his keynote report Amid profound global transformations in the new-energy industry, all-solid-state batteries—renowned for their high safety, high energy density, and long cycle life—have become the strategic high ground in the global race for next-generation battery technologies. In the solid-state battery sector, Delphi Laser has leveraged its strong expertise and forward-looking deployment in ultrafast laser technologies to develop targeted solutions covering processes such as electrode insulation grooving and roller cleaning. At the same time, the company is accelerating the validation of new processes including dry-electrode laser preheating and ultrafast laser slitting to further empower the industry. Delphi Laser has been invited to become a member of the All-Solid-State Battery Intelligent Manufacturing Platform. Initiated by the All-Solid-State Battery Manufacturing Process and Equipment Alliance and jointly established by leading domestic lithium-battery equipment enterprises, the platform aims to build an open and shared experimental platform, collaboratively optimize solid-state battery manufacturing processes and equipment, and form a national-level “main force” for intelligent manufacturing. Looking ahead, Delphi Laser will continue to deepen the integration and innovation of ultrafast laser processing technologies with battery manufacturing, working hand in hand with industry, academia, and research partners to inject fresh momentum into the development of the industry.
2025-05
From May 15 to 17, 2025, the highly influential battery industry event - the 17th Shenzhen International Battery Fair (CIBF2025) was grandly held in Shenzhen. Delphi Laser showcased multiple advanced lithium battery manufacturing solutions including roll-to-roll laser baking equipment, roller press laser online cleaning systems, lithium battery echelon utilization, and 500W femtosecond lasers.Using precision laser micromachining technology to empower intelligent lithium battery manufacturing, Delphi Laser's booth attracted tremendous popularity and became the focal point of the exhibition! Focusing on details and continuous innovation. At this year's CIBF2025, Delphi Laser concentrated on technological innovation, bringing multiple industry-first innovative solutions that focused on the entire process upgrade in the lithium battery field, attracting extensive attention from numerous exhibition visitors and partners. During the exhibition, Delphi Laser also gave presentations on topics including laser drying, all-solid-state battery applications, ultrafast lasers, and battery pack laser disassembly processes, engaging in in-depth exchanges and discussions with many industry professionals on site to share the latest research and application achievements. Presentation scene Accepted live interview by Gaogong Cloud Exhibition Delphi Laser looks forward to meeting you next time! Please continue to follow Delphi Laser!
2025-03
The 2025 LASER World of PHOTONICS CHINA successfully concluded. Delphi Laser, with innovative technologies and excellent products at its core, demonstrated cutting-edge laser solutions across multiple fields, receiving high recognition both within and outside the industry! Keynote Speeches During the exhibition, seven keynote speeches directly addressed industry pain points. Technical experts shared the latest R&D achievements and market prospects, creating an enthusiastic atmosphere on site! On-site Highlights Delphi Laser's booth was crowded with visitors. On-site audiences and partners experienced the charm of precision laser micro-processing up close, while jointly exploring its wide applications and future potential in the industry. On-site Activities The 2025 LASER World of PHOTONICS CHINA successfully concluded. Delphi Laser will continue to use "New Quality Productivity" as its engine, deepen laser applications and cutting-edge technologies, and drive innovative development in the industry!
2025-01
Recently, the China National Intellectual Property Administration (CNIPA) announced the eva1uation results of the 25th China Patent Awards. Suzhou Delphi Laser Co., Ltd. was honored with the "China Patent Excellence Award" for its patent titled "Device and Method for Asymmetric Beam Splitting Laser Processing of Transparent Materials", further demonstrating the company's strength in technological innovation. Since its establishment in 2005, Delphi Laser has consistently aligned with national R&D demands, placing high importance on intellectual property (IP) and actively advancing its IP-driven corporate strategy. The company has set up a dedicated IP management department, formulated strategic IP plans, and enhanced overall IP awareness. These efforts have earned it the titles of "National Intellectual Property Advantage Enterprise (2019)" and "National Intellectual Property Demonstration Enterprise (2022)". Moving forward, Delphi Laser will continue to uphold the principle of innovation-driven development, leverage its exemplary role, increase R&D investment, and actively explore new technologies and applications to enhance its core competitiveness. The company remains committed to achieving its goal of becoming a globally competitive IP powerhouse. About the China Patent Awards: Co-organized by the CNIPA and the World Intellectual Property Organization (WIPO), the China Patent Awards represent the only government-backed accolade in China that recognizes outstanding patented inventions. The awards aim to strengthen IP creation, protection, and utilization, promote high-quality economic development, and honor patentees and inventors (designers) who have made significant contributions to technological innovation and socio-economic progress.
2024-11
In November, the autumn breeze in Suzhou is just right, and Delphi Laser's annual marathon event is once again underway. The people of Dephi Laser, with their spirited attitude, measure the earth with their footsteps and write perseverance with their sweat. Wonderful Moments On the racecourse, the athletes from Delphi Laser showed exceptional style, surpassing themselves, moving forward courageously, and never giving up! It is worth mentioning that the female participants in this year's marathon competition were no less than their male counterparts, becoming a beautiful sight on the track. Award Group Photos 20km Group 10km Group 5km Women’s Group 5km Men’s Group Team Award: Operations Center Running never stops, and innovation continues without end. All employees of Delphi Laser will approach their work and life with greater enthusiasm, a strong body, and a spirited attitude. Looking ahead, Delphi Laser will run hand-in-hand with partners both inside and outside the industry to create brilliance together! Looking forward to next year’s Delphi Laser Marathon, continuing to create even more wonderful moments!
2024-09
Material Innovation, Empowering Development As the foldable smartphone market continues to surge, innovative materials have become the key to advancing this technology. This has heightened the demand for high-precision laser processing equipment. Delphi Laser, with its deep expertise and commitment to innovation, has strategically positioned itself in the foldable screen market. Its equipment has been successfully deployed in production lines, earning high recognition from clients and providing precise, efficient solutions for intelligent manufacturing in every detail of foldable smartphones. 1、Cover Glass Processing 1）UTG Glass Cutting System Ultra-Thin Glass (UTG) is increasingly favored for foldable display covers due to its ultra-thin, flexible, highly transparent, and high-temperature-resistant properties. Addressing the growing demand for UTG, Delphi Laser offers specialized UTG glass cutting equipment that ensures high-efficiency, precise cutting, enhancing production efficiency and yield rates. Advantages: Non-contact processing minimizes material damage and operating costs. High-speed, precision cutting with CCD vision alignment. Direct CAD import for quick and efficient cutting of various shapes. Industrial-grade design ensures stable 24/7 operation. Optional automated loading/unloading for increased efficiency and reduced labor. Samples： 2）CPI Laser Precision Micro-Processing System Transparent Polyimide (CPI), a critical material for foldable screens, offers stable performance, technical maturity, and cost advantages. Delphi Laser's CPI micro-processing equipment delivers high-precision, efficient cutting tailored to this key material. Advantages: High-speed processing with excellent precision, boosting productivity. Minimized thermal effects, reducing edge chipping. Advanced processing systems enable precise parameter and pattern matching. 3）Film Cutting and Stripping Integrated System This automated solution protects display covers from scratches and stains by efficiently handling film application and stripping. Delphi Laser’s cutting-edge design integrates laser cutting, vision alignment, and automated systems for seamless operation. Advantages: Automated tray transfer and robotic loading enhance productivity. Precision alignment ensures accurate cutting and film application. Customizable settings for various dimensions and positions. Stable, long-term operation supported by high-quality materials and software. 2、Carbon Fiber Processing Carbon Fiber Cutting System Carbon fiber, known for its lightweight and high-strength properties, is essential in foldable smartphone structural designs. Delphi Laser’s advanced carbon fiber cutting equipment ensures smooth, burr-free edges and optimized production efficiency. Advantages: High-speed, precise cutting reduces thermal effects and edge damage. Integrated systems for automated loading, cleaning, waste removal, and inspection. High-power laser systems developed in-house for cost-effective, high-performance processing. Samples： 3、Metal Hinge Processing Hinge Laser Welding System Metal hinges are critical components in foldable smartphones, providing structural support and enabling various folding mechanisms. Delphi Laser’s laser welding equipment ensures precise, high-quality welding for hinges, accommodating a variety of materials and designs. Advantages: Fast Welding Speed: Laser welding achieves high speed, significantly enhancing production efficiency and meeting the rapid manufacturing demands of foldable smartphones and other electronic products. Non-Contact Welding: As a non-contact process, laser welding minimizes stress impact on metal components. Controllable Welding Depth: By adjusting laser power and beam focus, precise control of welding depth is achieved, preventing defects from excessive or insufficient penetration. High Adaptability: Laser welding technology accommodates various sizes, shapes, and materials of metal hinges, offering greater design flexibility for foldable smartphones. Samples： 4、Flexible OLED Processing 1）Fully Automated Flexible OLED Shaped Cutting System This system is capable of easily handling complex shapes and curved cutting requirements. It precisely addresses the intricate folding shapes of smartphones. The equipment is primarily used for the fine-tuning and processing of AMOLED module segments, where the OLED panels are integrally cut by laser to improve edge precision and achieve irregular shape cutting. The system is equipped with an automatic image positioning system, multiple feeding and unloading interfaces, AOI (Automatic Optical Inspection), and USC (Ultrasonic Cleaning), ensuring efficient high-speed cutting and stable, high-quality operation. Advantages: It uses a UV picosecond/femtosecond laser combined with a galvanometer scanning system, enabling fast irregular shape cutting. Cutting quality: HAZ (Heat-Affected Zone) ≤ 50μm Cutting precision: CPK ≥ 1.33 (@±30μm) Fully automated Inline/Offline design, further reducing labor costs Compatible with OCA integrated cutting Samples： 2）Fully Automated Flexible OLED Laser Drilling System The core of a foldable smartphone lies in its foldable screen, which must maintain excellent performance and appearance during both folding and unfolding. Delong Laser's fully automated flexible OLED laser punching equipment is specifically designed for the AMOLED module display area. It uses advanced laser technology for punching the OLED panels in the AMOLED module to expose components such as the camera and other devices. By precisely controlling the laser energy and beam quality, it provides a reliable solution for manufacturing flexible display devices. Advantages: Utilizes UV femtosecond laser with a scanning galvanometer system to meet the demand for fast laser punching. Cutting quality: HAZ ≤ 40μm, no cracks, no rainbow patterns. Cutting precision: CPK ≥ 1.33 (@ ±30μm). Samples： 3）OLED/LCD Laser Repair System In the development of foldable smartphones, the perfect presentation of each pixel is an unwavering pursuit of quality. Delong Laser's OLED/LCD laser repair equipment is equipped with high-precision laser technology and advanced AOI (Automated Optical Inspection) technology, providing excellent imaging quality. The chosen control system components are highly precise, enabling the automatic detection and accurate positioning of OLED/LCD screen hotspots. Whether dealing with bright spots, weak bright spots, or partial dark spots, laser repair can be performed. The equipment features a compact structure and operates stably and reliably. Key Advantages: The equipment features a compact structure with a well-organized layout. It offers excellent compatibility. The motion system is stable and responsive. It delivers high precision, user-friendly interfaces, and easy maintenance. A strong technical team provides robust support for equipment installation, commissioning, and after-sales maintenance. Samples： 5、PCB/FPC Processing Picosecond Laser Precision Micro-Processing System PCB and FPC play crucial roles in foldable smartphones, together forming the complex and precise circuit system that ensures the normal operation and exceptional performance of the device. Delphi Laser's picosecond laser fine processing equipment, with its high precision, efficiency, and stability, is widely used in the fine processing fields of cutting, lid opening, and other applications for PCB, FPC rigid-flex boards, and related materials in foldable smartphones. The equipment utilizes advanced picosecond laser technology, meeting the stringent processing precision requirements for high-end electronic products such as foldable smartphones. Key Advantages: The equipment uses an independently developed high-power ultraviolet picosecond laser, offering high cost-effectiveness. It effectively controls the processing results, improving product edge collapse and thermal effects. The self-developed dual-station processing system is stable and reliable, significantly improving processing efficiency. The mature process system accurately calculates and splits graphics, ensuring the precise matching of processing parameters and design patterns. Innovation never stops, empowering the future Future Outlook Delphi Laser remains committed to innovation and excellence in laser micro-processing. By continuously advancing its technology, Delphi Laser empowers intelligent manufacturing, shaping the future of foldable smartphones and beyond.
