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CO2 Laser Ceramic Scribing System
This system is primarily used for laser scribing of ceramic substrates in the DBC (Direct Bond Copper) industry.
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Ultrafast Pulsed Laser Five-Axis Micro/Nano Machining system
The equipment achieves three-dimensional precision micro machining of various inclined surfaces, conical surfaces, and spherical surfaces through precise control of a multidimensional micro-displacement system.
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UV Nanosecond Laser Cutting System
This system is primarily designed for cutting and opening FPC and PCB boards. It excels in applications such as camera modules and fingerprint recognition.
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Wireless Charging Laser Cutting System
This system uses high-energy green laser to efficiently cut ferrite and other materials used in wireless charging. The cut edges are smooth and burr-free, with no blackening, and the process is highly efficient.
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Small to Medium-sized Thin Film Laser Etching System
This system is primarily used for etching silver paste, copper paste conductive coatings, ITO coatings, and nano-silver coatings on PET film or glass substrates.
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Fully Automatic Flexible OLED Contour Cutting System
This system is primarily used for precision finishing of AMOLED module segments, utilizing integrated laser cutting of OLED panels to enhance edge precision and achieve contour cutting.
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