Model：LUT-800； Laser mass transfer is used in the new display industry to transfer three-color chips to the substrate through direct transfer/secondary transfer.
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Model：AWD20； This fully automated laser system is designed for Through-Glass Via (TGV) microhole processing on wafer-level glass substrates of various materials with thicknesses ranging from 0.1 to 1 mm. It supports the fabrication of various via structures, including blind holes and conical through-holes.
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Model：ALS03； The system is used for etching the internal series circuits of perovskite thin film solar cells. The system integrates a variety of laser sources and can complete P1/P2/P3 scribing and P4 edge cleaning in the perovskite cell production process.
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Model：APM12； The Fully Automatic Laser Marking Machine is designed for marking post-packaging products. It supports both slot magazine and stack magazine loading/unloading methods. Based on customer process requirements, the machine can be configured in 1-in-1-out or 2-in-2-out models.
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Model：PRC series； Special optical design, non-destructive roller surface, capable of matching maximum operating speed ≥120 meters per minute.
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Model：RLH series； This system is primarily used for laser heating and dewatering of the positive and negative electrode sheets of lithium batteries.
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Model：LGC71； This system developed through special optical systems and processing software to achieve high-speed and stable cutting of curved glass.
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Model：FPS20/FPS24/FPS27； This equipment utilizes a high-energy customized laser to efficiently cut carbon fiber and other foldable display materials. The cut edges are smooth, burr-free, and free of burn marks, with fast processing speed. Equipped with an automatic vision positioning system and environmental safety features, the system ensures safe and high-speed automated cutting.
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The system is mostly equipped with self-produced ultrafast lasers. Improve system performance, reduce cost and ensure timely delivery. We can develop laser with laser process.
More than ten years of accumulation of laser fine micro processing, providing laser solutions for various ultra-thin, ultra-hard, brittle, flexible and transparent materials.
Various transfer and robot handling technologies available，Many years of automation experience to provide customers with a stable automation operating environment.
Micro LED Wafer Laser Mass Transfer System
Wafer-Level Laser Micro-Drilling System（TGV）
Thin Film Solar Cell Laser Integrated Processing System
Post-Molding Marking System(Rail-Type + Stack/Slot Loading/Unloading)
Laser Roller Cleaning System
Roll-to-Roll Laser Baking System
HUD Curved Glass Laser Cutting System
Carbon Fiber Cutting Application System
We offer laser applications for cutting, marking, drilling, etching, and welding on materials such as glass, ceramics, circuit boards (FPC/PCB), thin films, and metals—mainly for the automotive and consumer electronics sectors. For foldable devices, we provide comprehensive solutions covering cover glass, carbon fiber, metal hinges, OLED displays, circuit boards, and automation systems.
Electronics Industry
We primarily offer solutions for cutting and repair of TFT-LCD, AMOLED, and Mini LED displays, as well as peeling, transfer, and repair processes for Micro LED wafers.
Display Panel Industry
We mainly provide laser dicing for various wafer materials such as silicon, silicon carbide, gallium arsenide, lithium tantalate, lithium niobate, and glass. Key solutions include wafer laser grooving, silicon carbide ingot slicing, silicon carbide laser annealing, Through Glass Via (TGV), laser grooving (low-k), edge trimming, wafer marking, module drilling (TMV), laser debonding, and assisted welding for advanced packaging applications.
Semiconductor Industry
We have launched a range of innovative laser intelligent equipment for lithium battery manufacturing, including front-end process solutions and mid-to-back-end laser solutions. Our technology also supports solid-state battery production through roller cleaning and laser baking, and we provide precise disassembly solutions for lithium battery recycling and reuse.
Lithium Battery Industry
We supply complete production equipment for perovskite thin-film solar cells, including P0 laser marking, P1–P3 laser scribing, P4 edge deletion, material transfer and buffering systems, as well as downstream encapsulation and inspection equipment. We are also developing new products for crystalline silicon and BC cell photovoltaic technologies.
Photovoltaic Industry
From November 10–13, 2026, SEMICON Europa 2026 and electronica 2026 took place concurrently at Messe München in Munich, Germany. Delphi Laser showcased its precision laser processing solutions for semiconductor manufacturing and advanced substrates, focusing on wafer processing, advanced packaging and substrate manufacturing. The solutions on display covered two key areas: Semiconductor Manufacturing: Including SiC ingot slicing, wafer cutting for silicon and compound semiconductors, Low-k and backside metallization grooving, wafer marking, and laser micromachining for advanced packaging. Advanced Substrates: Covering IC substrates, PCB/HDI, ceramic substrates, glass/TGV, quartz and photonics components, with solutions for laser drilling, window opening, microvia processing, module singulation and sorting, and laser-assisted bonding (LAB). Building on its in-house R&D capabilities and accumulated process expertise, Delphi Laser continues to expand the applications of precision laser processing in semiconductor manufacturing and advanced substrates. Moving forward, the company will further strengthen technological innovation and international cooperation, providing global customers with tailored laser processingsolutions.
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On February 7–8, the Annual Meeting of the China Industry-University-Research Collaborative Innovation Platform for All-Solid-State Batteries and the 3rd China All-Solid-State Battery Innovation and Development Summit Forum was held in Beijing. Invited to attend, Delphi Laser joined industry experts to discuss technological innovation and industrialization progress in all-solid-state batteries, contributing to innovative breakthroughs and high-quality advancement of the sector. Event Photos As a core direction for next-generation battery technology, all-solid-state batteries face a range of systemic challenges, including material stability, high-precision manufacturing processes, and yield control in mass production. Leveraging its deep expertise in ultrafast laser technology, Delphi Laser focuses on addressing key pain points throughout the all-solid-state battery manufacturing process, and is committed to building targeted solution systems covering critical production stages. Laser Ablation for Insulation ▲ Solving challenges such as isostatic pressing collapse and short-circuit risks Laser Heating ▲ Improving yield in dry electrode coating and addressing efficient in-situ curing challenges for ceramic insulation zones High-Power Ultrafast Laser Die Cutting ▲ Solving key challenges including lithium metal electrode cutting and combustion propagation risks caused by the low ignition point of silicon-based anodes Looking ahead, Delphi Laser will continue to leverage ultrafast laser technology as a driving force, deepen collaborative innovation with industry chain partners, and accelerate the large-scale application of laser processes in all-solid-state battery manufacturing. Together, we aim to build a robust technology ecosystem and inject new momentum into the high-quality development of the industry.
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With the explosive rise of large AI models, demand for optical transceivers has surged. As core data-transmission components in AI intelligent computing centers, optical transceivers evolve in lockstep with the advancement of computing power. As AI computing demand grows exponentially, high-speed optical modules—serving as the “critical conduit” for data transmission—are experiencing a rapid market boom. In the ongoing evolution of optical-module manufacturing toward higher density, higher precision, and lower cost, laser micromachining technologies are playing an irreplaceable role. Breakthroughs in Optical Communication Technologies Strengthen the Foundation for AI Computing Power and Optoelectronic Integration Recognizing the long-term growth potential of the optical-transceiver market, Delphi Laser entered the field in 2019 by developing laser-based manufacturing equipment. After years of technological accumulation, the company now provides customers in the optical-communication industry with a comprehensive portfolio of solutions—including laser cutting, drilling, depaneling, etching, solder-ball placement, welding, and bonding—along with automated dispensing & assembly, sorting, AOI inspection, and testing systems. These solutions play a critical role in the production of high-speed optical modules. Laser Micromachining Solutions In the manufacturing of 800G and 1.6T high-speed optical modules, Delphi Laser’s micromachining solutions enable high-precision fabrication of key components, ensuring high yield and high-density interconnects. This enhances the performance of optical-interconnect devices from the source and significantly improves optical-signal coupling efficiency and transmission quality. · Laser bonding systems target the wire-bonding process within optical modules, using high-precision, low-stress laser-interconnect methods to improve connection reliability and high-speed electrical-signal integrity. · Laser solder-ball welding and ball-mounting equipment enable electrical interconnection between chips (such as BGA or CSP) and PCBs. Through precise solder-ball placement and controlled reflow, the equipment forms reliable joints, achieving both mechanical attachment and electrical conduction between chip and PCB pads. · Laser depaneling systems deliver ultra-high positional accuracy, narrow cutting kerfs, and burr- and dust-free processing, minimizing mechanical stress and providing a strong foundation for automated downstream assembly. · Laser cutting systems leverage non-contact processing to avoid internal stress in components, resulting in smoother edges, higher precision, and better yield. They are suitable for materials such as glass, ceramics, and optical fiber. Automation Solutions · Multi-station automated assembly solutions enable highly efficient integration and flexible manufacturing across the optical-module production process. · Automated chip-sorting solutions ensure accuracy and consistency in chip screening and packaging. · Automated AOI inspection systems integrate optical detection with intelligent recognition to conduct comprehensive defect screening. · Automated testing equipment performs fast and thorough performance verification of finished modules. By integrating raw-material preparation, precision machining, intelligent assembly, chip sorting, defect inspection, and performance testing into a unified closed-loop system, Delphi Laser ensures that high-speed optical modules maintain exceptional quality and stability even under large-scale production. Looking ahead, as demand for high-speed optical modules continues to accelerate, Delphi Laser’s full-industry-chain solutions will remain a strong enabler of AI computing power development.
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