Model：LLO-8600； The system uses laser lift-off technology to peel off Micro LED wafers.To the product +
Model：LUT-800； Laser mass transfer is used in the new display industry to transfer three-color chips to the substrate through direct transfer/secondary transfer.To the product +
Model：DLDS-8680； The system is used for laser slicing processing of silicon carbide ingots/pieces. After the laser processing is completed, it is used with an auxiliary dicing device to complete wafer dicing after slicing. The material loss is small, while the processing efficiency is high. No consumables are required to operate the equipment, and the processing cost is low.To the product +
Model：LGC71； The system is developed for curved glass cutting applications. It is customized and developed through a special optical system and processing software to achieve high-speed and stable cutting of curved glass.To the product +
Model：ALS03； The equipment is used for etching the internal series circuits of perovskite thin film solar cells. The equipment integrates a variety of laser sources and can complete P1/P2/P3 scribing and P4 edge cleaning in the perovskite cell production process.To the product +
Model：LGC52； The system achieves high-speed and stable cutting of UTG through the customized development of a special optical shaping system and processing software.To the product +
Model：Inducer-5560； Uses ultra-short pulse laser to achieve high quality and high efficient cutting of silicon carbide wafer.To the product +
Model：AGC39； This system is mainly used for solid screen chamfering and special-shaped processing such as LCD, LTPS, and OLED. The system is equipped with automatic image positioning, automatic handling axis, optical inspection (AOI), automatic loading and unloading and other sub-systems, which work together for the automatic high-speed cutting and high-quality stable operation of the product.To the product +
The system is mostly equipped with self-produced ultrafast lasers. Improve system performance, reduce cost and ensure timely delivery. We can develop laser with laser process.
More than ten years of accumulation of laser fine micro processing, providing laser solutions for various ultra-thin, ultra-hard, brittle, flexible and transparent materials.
Various transfer and robot handling technologies available，Many years of automation experience to provide customers with a stable automation operating environment.
Micro LED Wafer Laser Lift Off System
Micro LED wafer laser mass transfer system
Silicon Carbide Wafer Laser Processing System
HUD Curved Glass Laser Cutting System
Thin film solar cell laser integrated processing system
UTG Glass Laser Cutting System
Laser-Induced Dicing System for Silicon Carbide Wafers
Fully Automatic Glass Laser Chamfering System
In the field of new electronics, it is mainly used in cutting, drilling, and etching flexible circuit boards (FPC), printed circuit boards (PCB), ceramics, electric vehicle glass, automotive head-up display glass, LCP/MPI antennas, PET thin films, etc. Especially along with the development of new energy vehicles, the demand for precision processing of related soft boards, vehicle glass, etc. has given rise to more applications of ultraviolet and ultrafast lasers. The company launches supporting laser processing solutions for applications in the fields of automotive electronics, 5G, and consumer electronics.
Some of our laser solutions for display applications include laser cutting, marking, drilling, repair, and the peeling of flexible materials, conductive films, glass, and other materials. These solutions are widely used in LCD, OLED, and Mini&Micro LED, covering all product sizes from 0.9 inches to 110 inches.
The variety of laser solutions for semiconductor applications includes stealth dicing of LEDs, wafers, Si wafers, and silicon carbide/gallium arsenide/gallium nitride; wafer/chip marking; TGV laser drilling; laser annealing; laser debonding; Micro LED laser lift-off (LLO); laser-based mass transfer; and laser repair. Materials that can be processed include compound semiconductor wafers made of diamond, sapphire, quartz, optical glass, silicon, silicon carbide, gallium arsenide, and gallium nitride among others.
In the field of new energy, we deploy new energy applications such as lithium-ion batteries and photovoltaics. Our solutions include: perovskite thin film solar cell production equipment; printing screen laser plate making equipment; intelligent equipment related to lithium-ion and hydrogen fuel power cells; power system energy storage, base station energy storage, and home energy storage battery-related intelligent equipment.
The 3-day Laser World of Photonics China 2023 has come to a successful conclusion in Shanghai. Delphi Laser made its grand appearance with multi-field laser solutions, winning widespread attention and favor from many exhibitors and partners, and returning with a high reputation! Dr. Zhao Yuxing, Chairman of Delphi Laser, was interviewed by the media at the exhibition site The excitement continues Delphi Laser looks forward to seeing you next time!More +
On May 6, the "Chasing Light and Marching Forward"-Delphi Laser's first-anniversary celebration as a listed company and "Future of Photonics- Cutting-edge Photonics Technology and Industrial Innovation and Development Forum" were held by Delphi Laser in Suzhou. While reviewing and summarizing the past year as a listed company, Delphi Laser invited industry experts to focus on cutting-edge photonics technologies and their latest applications, discuss photonics technology innovation, look forward to the development of the photonics industry, empower the high-quality transformation and development of the photonics industry, and jointly promote the integration of government, industry, academia, and research institutes! Zhu Xiaoyan, Director of the Financial Development and Risk Prevention Bureau of the Suzhou Industrial Park, delivered a speech Wang Wenjie, Executive Director of Sunny Optical, delivered a speech Zhao Yuxing, Founder and Chairman of Delphi Laser, delivered a speech Forum site Delphi Laser continues to launch industry-specific equipment and new scenario application equipment with technical advantages. At this event, it also unveiled four products, attracting industry attention.More +
The 8th International Forum on Wide Bandgap Semiconductors and China Advanced Semiconductor Technology and Application Show kicked off in Suzhou on February 7. Delphi Laser was invited to make a grand appearance with its new Micro LED and silicon carbide solutions, which were widely concerned and highly praised both inside and outside the industry. Site of China Advanced Semiconductor Technology and Application Show ▼ Micro LED laser solutions▼ Micro LED wafer laser mass transfer system Model:LUT-800 Advantages √High yield √High efficiency √Fully automatic three-color loading and unloading Application Laser mass transfer is used in the new display industry to transfer three-color chips to the substrate through direct transfer/secondary transfer. Micro LED Wafer Laser Lift Off System Model:LLO-8600 Advantages √High yield √High efficiency √Full-surface /selective lift-off Application Applied to Micro LED wafer lift-off Micro LED wafer laser repair system Model:LTM-8810 Advantages √High yield √High efficiency Application Applied to laser repairing of Micro LED wafer ▼ Silicon carbide laser solutions▼ Silicon carbide wafer laser processing system Model:DLDS-8680 Advantages √Low material loss √High processing efficiency √No consumables are required to operate the equipment √Low processing cost Application Applied to wafer slicing processing of silicon carbide ingots (pieces) Laser annealing system for silicon carbide wafer Model:LAN-6281 Application Applied to silicon carbide wafer Laser-Induced Dicing System for Silicon Carbide Wafers Model:Inducer-5560 Advantages √High quality effect √Fast cutting speeds √High yield rates Application Wafer cutting of microwave devices and power devices used in the aerospace, power electronics and other industries (wafer with silicon carbide substrate).More +