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Laser-Induced Dicing System for Silicon Carbide Wafers
Uses ultra-short pulse laser to achieve high quality and high efficient cutting of silicon carbide wafer.
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Laser-Induced Wafer Dicing System
This device is used to cut Mini LED wafers using stress-induced cutting technology.
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Laser-Induced Dicing System for Glass Wafers
Uses visible or infrared laser for stealth dicing of transparent materials like coated glass and ordinary glass.
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Laser System for Wafer Grooving
The AS-5380 uses a high quality light beam to perform surface scribing and grooving in the wafer dicing channel.
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