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Micro LED Wafer Laser Mass Transfer System
Laser mass transfer is used in the new display industry to transfer three-color chips to the substrate through direct transfer/secondary transfer.
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Micro LED Wafer Laser Lift Off System
The system uses laser lift-off technology to peel off micro-LED wafers.
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Silicon Carbide Wafer Laser Processing System
The system is used for laser slicing processing of silicon carbide ingots/pieces.
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Silicon Carbide Wafer Laser Cutting Systerm
Uses ultra-short pulse laser to achieve high quality and high efficient cutting of silicon carbide wafer.
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Wafer Laser Grooving System
The AS-5380 uses a high quality light beam to perform surface scribing and grooving in the wafer dicing channel.
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Glass Wafers Laser-Induced Dicing System
Uses visible or infrared laser for stealth dicing of transparent materials like coated glass and ordinary glass.
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Wafer Laser Stress-Induced Dicing system
This system uses stress-induced cutting technology to process and cut Mini LED wafers.
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