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Processing materials

Laser-Induced Dicing System for Silicon Carbide Wafers
Uses ultra-short pulse laser to achieve high quality and high efficient cutting of silicon carbide wafer.
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Laser-Induced Wafer Dicing System
This device is used to cut Mini LED wafers using stress-induced cutting technology.
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Laser-Induced Dicing System for Glass Wafers
Uses visible or infrared laser for stealth dicing of transparent materials like coated glass and ordinary glass.
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Femtosecond Laser Fine Micromachining System
This equipment laser precision microfabrication system is mainly used for thin sheet metal cutting, drilling micro-nano group hole production, drilling, cutting and scribing processing of various materials.
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Laser Fine Processing System
This equipment is a laser cutting, drilling, etching and other forms of processing platform for various materials.
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Laser System for Wafer Grooving
The AS-5380 uses a high quality light beam to perform surface scribing and grooving in the wafer dicing channel.
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