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Micro LED wafer laser mass transfer system
Laser mass transfer is used in the new display industry to transfer three-color chips to the substrate through direct transfer/secondary transfer.
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Micro LED Wafer Laser Lift Off System
The system uses laser lift-off technology to peel off micro-LED wafers.
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Thin Film Solar Cell Laser Integrated Processing System
The system is used for etching the internal series circuits of perovskite thin film solar cells.
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HUD Curved Glass Laser Cutting System
This system developed through special optical systems and processing software to achieve high-speed and stable cutting of curved glass.
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Silicon Carbide Wafer Laser Processing System
The system is used for laser slicing processing of silicon carbide ingots/pieces.
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UTG Glass Laser Cutting System
The system achieves high-speed and stable cutting of UTG through the customized development of a special optical shaping system and processing software.
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Fully Automatic Glass Laser Chamfering System
This system is mainly used for solid screen chamfering and special-shaped processing such as LCD, LTPS, and OLED.
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Laser-Induced Dicing System for Silicon Carbide Wafers
Uses ultra-short pulse laser to achieve high quality and high efficient cutting of silicon carbide wafer.
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