2023-07
The 3-day Laser World of Photonics China 2023 has come to a successful conclusion in Shanghai. Delphi Laser made its grand appearance with multi-field laser solutions, winning widespread attention and favor from many exhibitors and partners, and returning with a high reputation! Dr. Zhao Yuxing, Chairman of Delphi Laser, was interviewed by the media at the exhibition site The excitement continues Delphi Laser looks forward to seeing you next time!
2023-02
The 8th International Forum on Wide Bandgap Semiconductors and China Advanced Semiconductor Technology and Application Show kicked off in Suzhou on February 7. Delphi Laser was invited to make a grand appearance with its new Micro LED and silicon carbide solutions, which were widely concerned and highly praised both inside and outside the industry. Site of China Advanced Semiconductor Technology and Application Show ▼ Micro LED laser solutions▼ Micro LED wafer laser mass transfer system Model:LUT-800 Advantages √High yield √High efficiency √Fully automatic three-color loading and unloading Application Laser mass transfer is used in the new display industry to transfer three-color chips to the substrate through direct transfer/secondary transfer. Micro LED Wafer Laser Lift Off System Model:LLO-8600 Advantages √High yield √High efficiency √Full-surface /selective lift-off Application Applied to Micro LED wafer lift-off Micro LED wafer laser repair system Model:LTM-8810 Advantages √High yield √High efficiency Application Applied to laser repairing of Micro LED wafer ▼ Silicon carbide laser solutions▼ Silicon carbide wafer laser processing system Model:DLDS-8680 Advantages √Low material loss √High processing efficiency √No consumables are required to operate the equipment √Low processing cost Application Applied to wafer slicing processing of silicon carbide ingots (pieces) Laser annealing system for silicon carbide wafer Model:LAN-6281 Application Applied to silicon carbide wafer Laser-Induced Dicing System for Silicon Carbide Wafers Model:Inducer-5560 Advantages √High quality effect √Fast cutting speeds √High yield rates Application Wafer cutting of microwave devices and power devices used in the aerospace, power electronics and other industries (wafer with silicon carbide substrate).
2021-05
This article belongs to Suzhou Delphi Laser Co., Ltd.(www.delphilaser.com), if reproduced, please indicate the company name and website With the acceleration of 5G construction process, the advanced ceramics industry ushers in a broader market prospect. Currently, China's advanced ceramics industry is in a critical period of transformation and upgrading. 2021 China International Advanced Ceramics Exhibition will be held on May 23-25 at the Shanghai World Expo Exhibition & Convention Center, which is dedicated to showcasing and promoting cutting-edge technologies at home and abroad, and building a quality platform for upstream and downstream practitioners to exchange technology and trade cooperation. 2021China International Advanced Ceramics Exhibition Time: May 23-25, 2021 地点：Shanghai World Expo Exhibition & Convention Center Pavilion H1 Delphilaser booth number：C546 In this exhibition, we will show you ceramic related laser fine processing solutions, I believe you will have a satisfactory harvest after visiting our booth. Delphilaser Booth Highlights ▼▼▼ We look forward to your visit to our booth,Shanghai World Expo Exhibition & Convention Center Pavilion H1C546！ This article belongs to Suzhou Delphi Laser Co., Ltd.(www.delphilaser.com), if reproduced, please indicate the company name and website For more information about our products and applications, please visit our website at: Delphilaser official website:www.delphilaser.com Ali store:tbdelphilaser.com Or scan the following two-dimensional code to follow our WeChat service number
2021-03
This article belongs to Suzhou Delphi Laser Co., Ltd.(www.delphilaser.com), if reproduced, please indicate the company name and website On March 17, the Munich Shanghai Optical Fair officially opened at the Shanghai New International Expo Center.Since its inception in 2006, Optotek Munich Shanghai has become an annual gathering of China's laser, optical and optoelectronic industries. The year-on-year increase of the exhibition data not only shows the influence of the Munich Shanghai Optical Fair, but also shows the strong belief in the development of China's optoelectronic industry. Delphilaser brings many new technologies to the show this timeW2-2102booth, as a multi-Fields laser application solution provider. For sixteen years we have been focusing on fine, dedicated to the innovation and development of laser technology, and have achieved continuous improvement and development in the direction of laser fine micro processing The exhibition site, Delphilaser booth exciting~ With advanced laser generator technology, high-precision motion control technology and profound accumulation of laser micro-processing process, Delphilaser focuses on laser industrial applications in semiconductor, display, 5G and other industries. In this exhibition, we bring“large format glass laser high speed cutting machine”。The device is made ofHigh energy laser on the glass for efficient cutting device. It is also equipped with automatic impact positioning system and environmental safety system to provide automatic high speed cutting and drilling processing of products. Combined with the rise of AMOLED display technology, the device has now been used in full-screen, OLED and shaped watches and other display body cutting Fields. Based on high-end, rooted in research We are always moving forward Empowering Modern Manufacturing with Advanced Lasers Helping smart manufacturing with cutting-edge technology We are always on the road to follow the light This article belongs to Suzhou Delphi Laser Co., Ltd.(www.delphilaser.com), if reproduced, please indicate the company name and website For more information about our products and applications, please visit our website at: Delphilaser official website:www.delphilaser.com Ali store:tbdelphilaser.com Or scan the following two-dimensional code to follow our WeChat service number
2021-03
This article belongs to Suzhou Delphi Laser Co., Ltd.(www.delphilaser.com), if reproduced, please indicate the company name and website In the spring and bright March, all things are renewed to celebrate another year We are still here Waiting for you 2102, Hall W2, Shanghai New International Expo Center Delphilaser invites you to meet us here Let's go to a spring appointment together Let's join this laser industry event together We will ride on the wind and waves, and will not be disappointed by the light of spring Light Fair 2021 in Munich, Shanghai Date: March 17-19, 2021 Exhibition Hall: Shanghai New International Expo Center Delphilaser booth number: W2 Hall 2102 With the continuous development of science and technology, laser in high-end manufacturing Fields has become one of the quite important processing technology. The 16th Munich Shanghai Optical Fair will be held soon, which has been the exhibition has made great contributions in helping the development of the industry, connecting the upstream and downstream of the photoelectric industry, expanding the whole industry chain and building a new photoelectric industry ecosystem. To better serve the laser industry and achieve multilateral win-win results. In this exhibition, Delphilaser has brought many new laser fine processing solutions with many highlights and wonderful. Glass laser high speed cutting lobe equipment ▼▼▼ Advantages Non-contact processing, less damage to the material, high cutting accuracy Layered cutting, full cutting, can be used to cut unstrengthened glass, cutting lobes in one piece with high yield Fully automatic loading and unloading equipment, reducing labor costs and improving process stability Fields Plain glass or chemically strengthened glass cutting Cell phone glass cover, full-screen LCD, OLED, LTPS and other display panel glass cutting We look forward to seeing you at our booth W2.2102, and we will see you soon. This article belongs to Suzhou Delphi Laser Co., Ltd.(www.delphilaser.com), if reproduced, please indicate the company name and website For more information about our products and applications, please visit our website at: Delphilaser official website:www.delphilaser.com Ali store:tbdelphilaser.com Or scan the following two-dimensional code to follow our WeChat service number
2020-12
This article belongs to Suzhou Delphi Laser Co., Ltd.(www.delphilaser.com), if reproduced, please indicate the company name and website Recently, Shenzhen with the temperature drop, has been successfully into autumn, but the domestic PCB industry is still in full swing! With the rise of 5G, to meet the challenges of 5G and development opportunities, the last PCB industry exhibition, the theme of "5G era - intelligent future" International Electronic Circuit (Shenzhen) Exhibition opened on December 2 as scheduled. Delphilaser is deeply engaged in laser fine micro processing Fields, always meet the market demand, actively respond to customer needs, and constantly introduce new solutions. Two laser solutions for the FPC/PCB industry, the Duplexing picosecond laser fine micromachining equipment (DPS21) and the four-station roll-to-sheet picosecond laser processing equipment (DRP10), were displayed and the processing demonstration was done on site. At the exhibition, our "Duplexing Picosecond Laser Micromachining Machine (DPS21)" and "Four-station Roll-to-Slice Picosecond Laser Processing Machine (DRP10)" attracted much attention. Duplexing picosecond laser fine micromachining equipment (DPS21) The equipment is a set of special equipment developed for Cutting and grooving of LCP/MPI/COF/COP/PI/CPI and other 5G materials and adhesive products in the consumer electronics industry. The equipment integrates a high-speed, high-precision optical processing system, an independent process, and a processing path optimization system, which can accurately Cut the shape and control the half-cut depth. The application of ultra-short pulse UV laser has greatly improved the processing quality of products. Four-station roll-to-roll picosecond laser processing equipment (DRP10) This equipment is designed for roll-to-sheet and roll-to-roll automatic processing equipment for cover film, COF, CPI and adhesive products. This equipment can be equipped with double optical path and four optical path systems for processing, which increases Processing efficiency, high Processing accuracy and fast Processing speed. This exhibition is an important communication platform for Delphilaser customers and industry insiders. The business elites and technical backbones of Delphilaser Precision Electronics Division keep their enthusiasm at all times and explain the equipment and solutions in depth with customers. 2020 International Electronic Circuits (Shenzhen) Exhibition has been successfully concluded, let us meet again next year…… This article belongs to Suzhou Delphi Laser Co., Ltd.(www.delphilaser.com), if reproduced, please indicate the company name and website For more information about our products and applications, please visit our website at: Delphilaser official website:www.delphilaser.com Ali store:tbdelphilaser.com Or scan the following two-dimensional code to follow our WeChat service number
2020-09
This article belongs to Suzhou Delphi Laser Co., Ltd.(www.delphilaser.com), if reproduced, please indicate the company name and website Coil has boundaries, die-cutting has no boundaries Enrich coil product structure Upgrade industry level Enhancement of industrial potential Actively promote the application of materials market and die-cutting processing technology progress "APFE" 16th Shanghai International Coil & Die Cut Exhibition Will be on September 28-30, 2020 Held at Shanghai National Convention and Exhibition Center (Shanghai-Hongqiao) Delphilaser Booth No.: Hall 7.1 5A250 With laser technology as the means, in recent years, around the new infrastructure and communication industry, Delphilaser has cut from 3C and 5G to provide excellent related products and application solutions for global smart manufacturing. Within the 3C and 5G industry, Delphilaser equipment can be applied to: base station antennas, RF devices, optical devices/optical modules, chips, dielectric waveguide filters, millimeter wave antennas, etc.. Processable materials are: LCP/MPI/COF/COP/PI/CPI and other 5G materials; FPC, PCB, FR4; auxiliary materials such as blue film backing, gold and silver foil, foam adhesive, covering film and other adhesive film types; ferrite, etc. In this exhibition, we will show you a variety of laser fine processing solutions related to coil and die-cutting, and there are professional technical staff on site to answer your questions. FPC/FCB industry laser application solutions UV picosecond fine micromachining equipment for 5G communication devices The equipment is a set of special equipment developed for Cutting and grooving of LCP/MPI/COF/COP/PI/CPI and other 5G materials and adhesive products in the consumer electronics industry. The equipment integrates a high-speed, high-precision optical processing system, an independent process, and a processing path optimization system, which can accurately Cut the shape and control the half-cut depth. The application of ultra-short pulse UV laser has greatly improved the processing quality of products. UV Nanosecond Laser Cutting Equipment The equipment is mainly for FPC, PCB sheet Cutting, open cover and other processing applications, and in the camera module, fingerprint recognition and other Applications outstanding performance, can also be mainly including polyimide and other polymer materials, ceramics, quartz, and other non-metallic materials, as well as tungsten copper and other various metal and alloy materials processing. Mulch film processing application equipment This machine is designed for roll-to-sheet and roll-to-roll automatic processing of cover film, COF, CPI and adhesive products. This machine is equipped with single optical path and double optical path systems, etc., with high Processing accuracy and fast Processing speed. Wireless Charging FieldsCutting Application Devices The equipment uses high energy (green light) laser for efficient Cutting of ferrite and other wireless charging materials. The edges of the products after Cutting are smooth and burr-free, with no black edges and fast efficiency. The equipment is equipped with automatic image positioning system and environmental safety system to provide automatic high speed Cutting of products. FR4 sheet Cutting application equipment The equipment uses high energy (green light) laser for efficient Cutting of FR4. The edges of the products after Cutting are smooth and burr-free without black edges, and the equipment is equipped with automatic image positioning system and environmental safety system for automatic high-speed Cutting of the products. Laser application solutions for die-cutting industry Die-cutting and proofing equipment The equipment is a set of roll-to-roll laser die-cutting equipment, with automatic laminating and waste discharge, self-correction, secondary three times alignment, to achieve no knife mark process, for adhesive products: FPC stainless steel backing, pressure-sensitive adhesive, SONY adhesive, AB adhesive, 3M, TESA double-sided adhesive / hot melt adhesive, black and white adhesive, self-adhesive, double-sided adhesive, easy to tear stickers, PE foam adhesive, PI / blue film backing, die-cutting conductive adhesive, etc.. Equipment integrated with high-speed, high-precision optical processing system, independent process, processing path optimization system, can accurately Cutting shape and control the depth of half-cut. Ultra-short pulse picosecond UV laser application, a large improvement in product processing quality. DRR11 picosecond laser device This machine is designed for roll-to-sheet and roll-to-roll automatic processing of cover film, COF, CPI and adhesive products, with high Processing accuracy and fast Processing speed. Products include: backing, pressure-sensitive adhesive, SONY adhesive, AB adhesive, 3M, TESA double-sided adhesive/hot melt adhesive, black and white adhesive, self-adhesive, double-sided adhesive, easy-peel sticker, PE foam adhesive, PI/blue film backing, special equipment for die-cutting conductive adhesive, etc.The equipment integrates high speed and high precision optical processing system, independent process, processing path optimization system, which can accurately Cutting shape and control the half-cut depth. Ultra-short pulse UV laser application greatly improves the processing quality of products. In addition, there will be equipment on display, so stay tuned! This article belongs to Suzhou Delphi Laser Co., Ltd.(www.delphilaser.com), if reproduced, please indicate the company name and website For more information about our products and applications, please visit our website at: Delphilaser official website:www.delphilaser.com Ali store:tbdelphilaser.com Or scan the following two-dimensional code to follow our WeChat service number
