This equipment utilizes a high-precision nanometer-level air-bearing platform, combined with a five-axis galvo optical module and a self-developed laser processing system. It achieves ultra-high precision cutting, drilling, and other processes. The taper
This system is primarily used for cutting and drilling ceramic substrates in high-power electronics modules, aerospace, military electronics, and related products.
The equipment achieves three-dimensional precision micro machining of various inclined surfaces, conical surfaces, and spherical surfaces through precise control of a multidimensional micro-displacement system.
