Laser Fine Processing System
This equipment is a laser cutting, drilling, etching and other forms of processing platform for various materials.
Inquiry Phone：0512-6507 0150
E-mail：yj.tao@delphilaser.com■ Equipment parameters：
Laser Types | Semiconductor-pumped laser (wavelength optional) |
Laser power | ≥8-100W（Optional） |
Cooling method | Closed-cycle water cooling |
Scanning speed | 3000mm/s |
Scribe size | 8 inch |
Laser processing effect | ＜20um（Edge chipping & thermal effects） |
Cutting lane width | ≧30um |
■ Equipment Advantages：
◆ Wide range of device applications and high platform compatibility
◆ Numerous machining processes to meet a variety of precision machining requirements
◆ Large scalability and expandability of equipment
■ Applications：
◆ Applications for precision machining of most materials (cutting, drilling, etching, surface treatment, grooving, etc.)
■ Processing example diagram：
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