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UV Picosecond Laser Micromachining System
This system is specially developed for cutting and grooving of 5G materials and adhesive products such as LCP/MPI/COF/COP/PI/CPI in the consumer electronics industry with the integration of the high-speed and the high-precision optical processing system.
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UV Nanosecond Laser Cutting System
The equipment is mainly for FPC, PCB sheet cutting, open cover and other processing applications, and in the camera module, fingerprint identification and other applications outstanding performance, can also be mainly including polyimide and other polymer
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Reel-to-Reel FPC Drilling Application System
The processing application object is the precision drilling application of PCB, which can be used for the blind hole and through-hole operation of double-sided copper-clad board. The equipment components are efficiently integrated, including laser, optica
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Laser Fine Processing System
This equipment is a laser cutting, drilling, etching and other forms of processing platform for various materials.
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