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Processing materials

UV Picosecond Laser Micromachining System
This system is specifically developed for cutting and engraving LCP/MPI/COF/COP/PI/CPI materials and adhesive products.
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Ultrafast Pulsed Laser Five-Axis Micro/Nano Machining system
The equipment achieves three-dimensional precision micro machining of various inclined surfaces, conical surfaces, and spherical surfaces through precise control of a multidimensional micro-displacement system.
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PCB Laser Precision Drilling System
The processing target is PCBs, suitable for blind and through-hole operations on double-sided copper-clad boards. It can also be equipped with a roll-to-roll mechanism for processing rolled materials.
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UV Nanosecond Laser Cutting System
This system is primarily designed for cutting and opening FPC and PCB boards. It excels in applications such as camera modules and fingerprint recognition.
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