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Processing materials

UV Picosecond Laser Micromachining System
This System is specially developed for cutting and grooving of 5G materials and adhesive products such as LCP/MPI/COF/COP/PI/CPI.
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UV Nanosecond Laser Cutting System
The equipment is mainly for FPC, PCB sheet cutting, open cover and other processing applications.
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Reel-to-Reel FPC Drilling Application System
The system is used for precision drilling of PCB, the blind hole and through hole of double-sided copper clad laminates.
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Laser Fine Processing System
This equipment is a laser cutting, drilling, etching and other forms of processing platform for various materials.
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