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HUD Curved Glass Laser Cutting System
This system developed through special optical systems and processing software to achieve high-speed and stable cutting of curved glass.
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UTG Glass Laser Cutting System
The system achieves high-speed and stable cutting of UTG through the customized development of a special optical shaping system and processing software.
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Femtosecond Five-Axis (Galvo) Laser Precision Machining system
This equipment utilizes a high-precision nanometer-level air-bearing platform, combined with a five-axis galvo optical module and a self-developed laser processing system. It achieves ultra-high precision cutting, drilling, and other processes. The taper
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Fully Automatic Glass Laser High-Speed Cutting System
This system utilizes high-energy infrared femtosecond pulse laser for specialized shaping and efficient cutting of glass. It has been widely applied in fields such as smart wearables, household appliances, security systems, and mobile phone cover panels.
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Wafer Laser Grooving System
The AS-5380 uses a high quality light beam to perform surface scribing and grooving in the wafer dicing channel.
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Glass Laser Drilling System
This system efficiently drills glass using high-energy lasers, resulting in small burrs, high precision, and excellent quality.
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Ultrafast Pulsed Laser Five-Axis Micro/Nano Machining system
The equipment achieves three-dimensional precision micro machining of various inclined surfaces, conical surfaces, and spherical surfaces through precise control of a multidimensional micro-displacement system.
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Glass Wafers Laser-Induced Dicing System
Uses visible or infrared laser for stealth dicing of transparent materials like coated glass and ordinary glass.
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