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Glass Laser Cutting and Breaking System
Using high-energy infrared picosecond pulsed laser to cut the glass. The device is equipped with the automatic image positioning system and environmental safety system to guarantee the automatic high-speed cutting and drilling of the product. With the ris
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Laser-Induced Dicing System for Glass Wafers
Uses visible or infrared laser for stealth dicing of transparent materials like coated glass and ordinary glass.
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Femtosecond Laser Fine Micromachining System
This equipment laser precision microfabrication system is mainly used for thin sheet metal cutting, drilling micro-nano group hole production, drilling, cutting and scribing processing of various materials.
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Laser Fine Processing System
This equipment is a laser cutting, drilling, etching and other forms of processing platform for various materials.
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Laser Drilling System for Tempered Glass
The machine uses a high-energy laser for efficient drilling of glass. The machine is equipped with automatic image positioning system and environmental safety system to provide automatic high speed drilling process for products.
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Laser System for Wafer Grooving
The AS-5380 uses a high quality light beam to perform surface scribing and grooving in the wafer dicing channel.
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