Laser-Induced Dicing System for Glass Wafers
Uses visible or infrared laser for stealth dicing of transparent materials like coated glass and ordinary glass.
■ Specifications
◆ Laser type: DPSS picosecond laser (532nm & 1064nm)
◆ Laser power: ≥5W
◆ Cooling method: Closed-loop water cooling
◆ X-axis: 300mm travel length, 0.1μm resolution
◆ Y-axis: 280mm travel length, 0.1μm resolution
◆ Z-axis: 5mm travel length, 1μm resolution
◆ θ-axis: 120° travel angle, 0.001° resolution
◆ Maximum cutting thickness: 1.2mm
◆ Automatic loading and unloading of workpiece
◆ Cutting speed: 0-800mm/s
◆ Cutting chipping: <20μm
◆ Micro cracks in the cutting section: <10μm
■ Advantages
◆ Fast scribing speed, high throughput
◆ High-quality processing results, significant improvements in yield rates
◆ No consumables, Low operating costs
■ Applications
Straight cutting of the coated glass (filter) in the camera industry;
Straight cutting of ordinary glass or transparent materials within 1mm thickness, applicable to the electronic, medical, and display industry.
■ Samples
For more information