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Laser-Induced Dicing System for Glass Wafers

Uses visible or infrared laser for stealth dicing of transparent materials like coated glass and ordinary glass.

  • Inquiry Phone:+86-512-65070150
  • E-mail:yj.tao@delphilaser.com

■ Specifications

◆ Laser type: DPSS picosecond laser (532nm & 1064nm)

◆ Laser power: ≥5W

◆ Cooling method: Closed-loop water cooling

◆ X-axis: 300mm travel length, 0.1μm resolution

◆ Y-axis: 280mm travel length, 0.1μm resolution

◆ Z-axis: 5mm travel length, 1μm resolution

◆ θ-axis: 120° travel angle, 0.001° resolution

◆ Maximum cutting thickness: 1.2mm

◆ Automatic loading and unloading of workpiece

◆ Cutting speed: 0-800mm/s

◆ Cutting chipping: <20μm

◆ Micro cracks in the cutting section: <10μm



■ Advantages

◆ Fast scribing speed, high throughput

◆ High-quality processing results, significant improvements in yield rates

◆ No consumables, Low operating costs



■ Applications

     Straight cutting of the coated glass (filter) in the camera industry;

     Straight cutting of ordinary glass or transparent materials within 1mm thickness, applicable to the electronic, medical, and display industry.



■ Samples

     


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