Home>Products>Processing materials>Ceramics

Processing materials

UV Nanosecond Laser Cutting System
The equipment is mainly for FPC, PCB sheet cutting, open cover and other processing applications.
More +

Femtosecond Laser Rotary Precision Machining System
This equipment laser precision microfabrication system is mainly used for thin sheet metal cutting, drilling micro-nano group hole production, drilling, cutting and scribing processing of various materials.
More +

Laser Fine Processing System
This equipment is a laser cutting, drilling, etching and other forms of processing platform for various materials.
More +

Ultra-short Pulse LTCC/HTCC Drilling and Etching System
The equipment is mainly used for fast processing of through-hole, semi-through-hole and cavity of LTCC billets, ferrite and other materials.
More +

Laser System for Wafer Grooving
The AS-5380 uses a high quality light beam to perform surface scribing and grooving in the wafer dicing channel.
More +

Fiber Laser Ceramic Processing System
The equipment is using infrared pulse laser, its peak power can reach 10 times the average power, high advantages in scribing, cutting, etc.
More +

CO2 Laser Ceramic Processing System
This machine is a device that applies CO2 for efficient cutting on ceramics, acrylic, rubber and other materials.
More +