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Femtosecond Five-Axis (Galvo) Laser Precision Machining system
This equipment utilizes a high-precision nanometer-level air-bearing platform, combined with a five-axis galvo optical module and a self-developed laser processing system. It achieves ultra-high precision cutting, drilling, and other processes. The taper
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Wafer Laser Grooving System
The AS-5380 uses a high quality light beam to perform surface scribing and grooving in the wafer dicing channel.
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CO2 Laser Ceramic Scribing System
This system is primarily used for laser scribing of ceramic substrates in the DBC (Direct Bond Copper) industry.
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Fiber Laser Ceramic Cutting System
This system is primarily used for cutting and drilling ceramic substrates in high-power electronics modules, aerospace, military electronics, and related products.
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LTCC/HTCC Laser Drilling and Etching System
The system is mainly used for the rapid processing of through-holes, partial holes, and cavities in LTCC (Low Temperature Co-fired Ceramic) green bodies, ferrites, and other materials.
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Ultrafast Pulsed Laser Five-Axis Micro/Nano Machining system
The equipment achieves three-dimensional precision micro machining of various inclined surfaces, conical surfaces, and spherical surfaces through precise control of a multidimensional micro-displacement system.
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UV Nanosecond Laser Cutting System
This system is primarily designed for cutting and opening FPC and PCB boards. It excels in applications such as camera modules and fingerprint recognition.
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