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Processing materials

Wireless Charging Field Cutting Application System
The equipment uses high energy (green light) laser to cut wireless charging materials such as ferrite with high efficiency. The cut products have smooth and burr-free edges, no black edges and high efficiency. The equipment is equipped with automatic imag
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UV Nanosecond Laser Cutting System
The equipment is mainly for FPC, PCB sheet cutting, open cover and other processing applications, and in the camera module, fingerprint identification and other applications outstanding performance, can also be mainly including polyimide and other polymer
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Femtosecond Laser Fine Micromachining System
This equipment laser precision microfabrication system is mainly used for thin sheet metal cutting, drilling micro-nano group hole production, drilling, cutting and scribing processing of various materials.
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Laser Fine Processing System
This equipment is a laser cutting, drilling, etching and other forms of processing platform for various materials.
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Ultra-short Pulse LTCC/HTCC Drilling and Etching System
The equipment is mainly used for fast processing of through-hole, semi-through-hole and cavity of LTCC billets, ferrite and other materials, and also for fine processing such as etching and cutting of various materials.
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Laser System for Wafer Grooving
The AS-5380 uses a high quality light beam to perform surface scribing and grooving in the wafer dicing channel.
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Fiber Laser Ceramic Processing System
The equipment is using infrared pulse laser, its peak power can reach 10 times the average power, high advantages in scribing, cutting, etc.; combined with the optimization of electronic control and optics, so that the fiber optic equipment processed by t
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CO2 Laser Ceramic Processing System
This machine is a device that applies CO2 for efficient cutting on ceramics, acrylic, rubber and other materials. It integrates new technology development and integrates and optimizes the scribing and cutting functions of the machine for customer needs to
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