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Processing materials

Wireless Charging Field Cutting Application System
The equipment uses high energy (green light) laser to cut wireless charging materials such as ferrite with high efficiency.
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UV Nanosecond Laser Cutting System
The equipment is mainly for FPC, PCB sheet cutting, open cover and other processing applications.
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Femtosecond Laser Rotary Precision Machining System
This equipment laser precision microfabrication system is mainly used for thin sheet metal cutting, drilling micro-nano group hole production, drilling, cutting and scribing processing of various materials.
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Laser Fine Processing System
This equipment is a laser cutting, drilling, etching and other forms of processing platform for various materials.
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Ultra-short Pulse LTCC/HTCC Drilling and Etching System
The equipment is mainly used for fast processing of through-hole, semi-through-hole and cavity of LTCC billets, ferrite and other materials.
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Laser System for Wafer Grooving
The AS-5380 uses a high quality light beam to perform surface scribing and grooving in the wafer dicing channel.
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Fiber Laser Ceramic Processing System
The equipment is using infrared pulse laser, its peak power can reach 10 times the average power, high advantages in scribing, cutting, etc.
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CO2 Laser Ceramic Processing System
This machine is a device that applies CO2 for efficient cutting on ceramics, acrylic, rubber and other materials.
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