This equipment utilizes a high-precision nanometer-level air-bearing platform, combined with a five-axis galvo optical module and a self-developed laser processing system. It achieves ultra-high precision cutting, drilling, and other processes. The taper
This system is primarily used for cutting and drilling ceramic substrates in high-power electronics modules, aerospace, military electronics, and related products.
The system is mainly used for the rapid processing of through-holes, partial holes, and cavities in LTCC (Low Temperature Co-fired Ceramic) green bodies, ferrites, and other materials.
The equipment achieves three-dimensional precision micro machining of various inclined surfaces, conical surfaces, and spherical surfaces through precise control of a multidimensional micro-displacement system.
This system is primarily designed for cutting and opening FPC and PCB boards. It excels in applications such as camera modules and fingerprint recognition.
