Wafer Laser Grooving System
The AS-5380 uses a high quality light beam to perform surface scribing and grooving in the wafer dicing channel.
■ Specifications:
◆ Applicable materials: Low-k, metal, ceramic, glass, etc.
◆ Laser type: DPSS ultraviolet laser
◆ Laser power: ≥5W
◆ Cooling method: Closed-loop water cooling
◆ Grooving depth: >10μm
◆ Cutting-axis speed: 0-800mm/s
◆ Applicable wafer size: 12 inches
◆ Upper surface precision: 0.01mm/300mm
◆ Cleaning plate rotation speed: 2500r/min
◆ Rotational accuracy: 0.01°
◆ Processing method: Automatic front-side grooving
◆ Focusing mode: Auto-focusing
◆ Lighting system: Point light source
■ Advantages:
◆ Effectively reduce edge collapse and delamination, improving yield.
◆ Grooving width and depth are adjustable.
■ Applications:
◆ Surface grooving of low-k wafer used in the 40nm or smaller process.
◆ Surface scribing or grooving of semiconductor wafer.
■ Samples:
For more information