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Femtosecond Five-Axis (Galvo) Laser Precision Machining system
Model:LPD20
This equipment utilizes a high-precision nanometer-level air-bearing platform, combined with a five-axis galvo optical module and a self-developed laser processing system. It achieves ultra-high precision cutting, drilling, and other processes. The taper
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LTCC/HTCC Laser Drilling and Etching System
Model:
The system is mainly used for the rapid processing of through-holes, partial holes, and cavities in LTCC (Low Temperature Co-fired Ceramic) green bodies, ferrites, and other materials.
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Glass Laser Drilling System
Model:LGE10
This system efficiently drills glass using high-energy lasers, resulting in small burrs, high precision, and excellent quality.
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Ultrafast Pulsed Laser Five-Axis Micro/Nano Machining system
Model:LMS10
The equipment achieves three-dimensional precision micro machining of various inclined surfaces, conical surfaces, and spherical surfaces through precise control of a multidimensional micro-displacement system.
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PCB Laser Precision Drilling System
Model:
The processing target is PCBs, suitable for blind and through-hole operations on double-sided copper-clad boards. It can also be equipped with a roll-to-roll mechanism for processing rolled materials.
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