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Processing method

Reel-to-Reel FPC Drilling Application System
The processing application object is the precision drilling application of PCB, which can be used for the blind hole and through-hole operation of double-sided copper-clad board. The equipment components are efficiently integrated, including laser, optica
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Femtosecond Laser Fine Micromachining System
This equipment laser precision microfabrication system is mainly used for thin sheet metal cutting, drilling micro-nano group hole production, drilling, cutting and scribing processing of various materials.
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Laser Fine Processing System
This equipment is a laser cutting, drilling, etching and other forms of processing platform for various materials.
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Laser Drilling System for Tempered Glass
The machine uses a high-energy laser for efficient drilling of glass. The machine is equipped with automatic image positioning system and environmental safety system to provide automatic high speed drilling process for products.
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Ultra-short Pulse LTCC/HTCC Drilling and Etching System
The equipment is mainly used for fast processing of through-hole, semi-through-hole and cavity of LTCC billets, ferrite and other materials, and also for fine processing such as etching and cutting of various materials.
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