PCB Laser Precision Drilling System
The processing target is PCBs, suitable for blind and through-hole operations on double-sided copper-clad boards. It can also be equipped with a roll-to-roll mechanism for processing rolled materials.
■ Specifications:
Platform size | 650mm×550 mm(Customizable) | |
Material thickness | 20μm–254μm | |
Positioning accuracy | Cpk≥1.67 (@±20μm) | |
Minimum drill hole diameter | 50μm | |
Maximum platform speed | 1000mm/s | |
Quality | Roundness | ≥90% |
Hole diameter tolerance | ±5μm | |
Taper | Taper≥90% | |
Etch back | ≤5μm |
■ Advantages:
◆ Effectively controlling processing thermal effects, significantly improving product burr and heat effects.
◆ Mature process processing system capable of accurately calculating and dividing graphics, achieving process matching of processing parameters and processing graphics.
■ Applications:
Used for blind hole and through hole operations on double-sided copper-clad boards.
■ Samples:
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