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PCB Laser Precision Drilling System

The processing target is PCBs, suitable for blind and through-hole operations on double-sided copper-clad boards. It can also be equipped with a roll-to-roll mechanism for processing rolled materials.

  • Inquiry Phone:+86-512-6507 0150
  • E-mail:yj.tao@delphilaser.com

■ Specifications:

Platform   size

650mm×550   mmCustomizable

Material   thickness

20μm–254μm

Positioning   accuracy

Cpk≥1.67   (@±20μm)

Minimum   drill hole diameter

50μm

Maximum   platform speed

1000mm/s

Quality

Roundness

≥90%

Hole   diameter tolerance

±5μm

Taper

Taper≥90%

Etch back

≤5μm



■ Advantages:

◆ Effectively controlling processing thermal effects, significantly improving product burr and heat effects.

◆ Mature process processing system capable of accurately calculating and dividing graphics, achieving process matching of processing parameters and processing graphics.



■ Applications:

Used for blind hole and through hole operations on double-sided copper-clad boards.



■ Samples:

     



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