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Micro LED Wafer Laser Mass Transfer System
Laser mass transfer is used in the new display industry to transfer three-color chips to the substrate through direct transfer/secondary transfer.
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Wafer-Level Laser Micro-Drilling System
This fully automated laser system is designed for Through-Glass Via (TGV) microhole processing on wafer-level glass substrates of various materials with thicknesses ranging from 0.1 to 1 mm. It supports the fabrication of various via structures, including
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Laser Roller Cleaning System
Special optical design, non-destructive roller surface, capable of matching maximum operating speed ≥120 meters per minute.
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Post-Molding Marking System(Rail-Type + Stack/Slot Loading/Unloading)
The Fully Automatic Laser Marking Machine is designed for marking post-packaging products. It supports both slot magazine and stack magazine loading/unloading methods. Based on customer process requirements, the machine can be configured in 1-in-1-out or
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Thin Film Solar Cell Laser Integrated Processing System
The system is used for etching the internal series circuits of perovskite thin film solar cells.
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Carbon Fiber Cutting Application System
This equipment utilizes a high-energy customized laser to efficiently cut carbon fiber and other foldable display materials. The cut edges are smooth, burr-free, and free of burn marks, with fast processing speed. Equipped with an automatic vision positio
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Battery Cell Film Laser Removal System
This system is designed for the automatic processing of insulation film removal in the battery cell rework process. It is equipped with a laser processing system and an automatic film removal system. It operates at high speed with high product yield, main
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HUD Curved Glass Laser Cutting System
This system developed through special optical systems and processing software to achieve high-speed and stable cutting of curved glass.
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