This system is primarily used for cutting and drilling ceramic substrates in high-power electronics modules, aerospace, military electronics, and related products.
The system is mainly used for the rapid processing of through-holes, partial holes, and cavities in LTCC (Low Temperature Co-fired Ceramic) green bodies, ferrites, and other materials.
The equipment achieves three-dimensional precision micro machining of various inclined surfaces, conical surfaces, and spherical surfaces through precise control of a multidimensional micro-displacement system.
It is mainly used for repairing defective pixels on flexible OLED panels and LCD liquid crystal panels. It automatically detects defects using AOI (Automated Optical Inspection) systems and uses laser technology to repair these defects.
The processing target is PCBs, suitable for blind and through-hole operations on double-sided copper-clad boards. It can also be equipped with a roll-to-roll mechanism for processing rolled materials.
