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UV Nanosecond Laser Cutting System
This system is primarily designed for cutting and opening FPC and PCB boards. It excels in applications such as camera modules and fingerprint recognition.
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Glass Wafers Laser-Induced Dicing System
Uses visible or infrared laser for stealth dicing of transparent materials like coated glass and ordinary glass.
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Wireless Charging Laser Cutting System
This system uses high-energy green laser to efficiently cut ferrite and other materials used in wireless charging. The cut edges are smooth and burr-free, with no blackening, and the process is highly efficient.
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Small to Medium-sized Thin Film Laser Etching System
This system is primarily used for etching silver paste, copper paste conductive coatings, ITO coatings, and nano-silver coatings on PET film or glass substrates.
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Wafer Laser Stress-Induced Dicing system
This system uses stress-induced cutting technology to process and cut Mini LED wafers.
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Fully Automatic Flexible OLED Contour Cutting System
This system is primarily used for precision finishing of AMOLED module segments, utilizing integrated laser cutting of OLED panels to enhance edge precision and achieve contour cutting.
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Fully Automatic Glass Laser Chamfering System
This system is mainly used for chamfering and shaping hard screens such as LCDs, LTPS, and OLEDs.
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