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CO2 Laser Ceramic Scribing System

This system is primarily used for laser scribing of ceramic substrates in the DBC (Direct Bond Copper) industry.

  • Inquiry Phone:86-512-65070150
  • E-mail:yj.tao@delphilaser.com

■ Specifications:

Model

CPP12/30

CPP21

Type

Single Optical Path Single Workstation

Dual Optical Path Dual Workstation

Processing Area

200mm×200mmCustomizable

Positioning Accuracy

±3μm

Repeat Accuracy

±2μm

Scribing Speed

200mm/s

Cutting Speed

20mm/s

Cutting Thickness

2mm

Scribing Depth

500μm

Scribing Width

150μm



■ Advantages:

◆ Non-contact processing minimizes material damage and achieves high cutting precision.

◆ Layered cutting meets various processing needs for materials.

◆ Coaxial air blowing during cutting protects the material.



■ Applications:

     Used for scribing various DBC ceramic substrates such as alumina (Al₂O₃), aluminum nitride (AlN), zirconia (ZrO₂), and silicon nitride (Si₃N₄).


■ Samples:

      



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