CO2 Laser Ceramic Scribing System
This system is primarily used for laser scribing of ceramic substrates in the DBC (Direct Bond Copper) industry.
■ Specifications:
Model | CPP12/30 | CPP21 |
Type | Single Optical Path Single Workstation | Dual Optical Path Dual Workstation |
Processing Area | 200mm×200mm(Customizable) | |
Positioning Accuracy | ±3μm | |
Repeat Accuracy | ±2μm | |
Scribing Speed | 200mm/s | |
Cutting Speed | 20mm/s | |
Cutting Thickness | 2mm | |
Scribing Depth | 500μm | |
Scribing Width | 150μm |
■ Advantages:
◆ Non-contact processing minimizes material damage and achieves high cutting precision.
◆ Layered cutting meets various processing needs for materials.
◆ Coaxial air blowing during cutting protects the material.
■ Applications:
Used for scribing various DBC ceramic substrates such as alumina (Al₂O₃), aluminum nitride (AlN), zirconia (ZrO₂), and silicon nitride (Si₃N₄).
■ Samples:
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