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Processing materials

UV Picosecond Laser Micromachining System
This system is specially developed for cutting and grooving of 5G materials and adhesive products such as LCP/MPI/COF/COP/PI/CPI in the consumer electronics industry with the integration of the high-speed and the high-precision optical processing system.
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Covering film/vehicle FPC processing Application System
This machine is designed for roll-to-sheet and roll-to-roll automatic processing equipment for cover film, COF, CPI and adhesive products, which is equipped with single optical path, double optical path and other systems for high processing accuracy and f
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Thin Film Laser Etching System
The equipment is mainly used for etching process of silver paste, copper paste conductive coating, ITO coating and nano silver coating on PET film or glass substrate. The equipment is equipped with a large format 2500mm x 2000mm and multi-head high speed
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Reel-to-Reel FPC Drilling Application System
The processing application object is the precision drilling application of PCB, which can be used for the blind hole and through-hole operation of double-sided copper-clad board. The equipment components are efficiently integrated, including laser, optica
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Laser Fine Processing System
This equipment is a laser cutting, drilling, etching and other forms of processing platform for various materials.
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Roll-to-roll Laser Etching System for Thin Films
Roll to roll laser processing system with etching, cutting, marking and other RTR functions.
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