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Processing materials

UV Picosecond Laser Micromachining System
This System is specially developed for cutting and grooving of 5G materials and adhesive products such as LCP/MPI/COF/COP/PI/CPI.
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Laser System for Cover Film/Vehicle FPC
The roll-to-sheet and roll-to-roll automatic machining system is specially designed for cover film, COF, CPI and adhesive products.
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Thin Film Laser Etching System
The equipment is mainly used for etching process of silver paste, copper paste conductive coating, ITO coating and nano silver coating on PET film or glass substrate.
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Reel-to-Reel FPC Drilling Application System
The system is used for precision drilling of PCB, the blind hole and through hole of double-sided copper clad laminates.
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Laser Fine Processing System
This equipment is a laser cutting, drilling, etching and other forms of processing platform for various materials.
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Roll-to-roll Laser Etching System for Thin Films
Roll to roll laser processing system with etching, cutting, marking and other RTR functions.
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