The equipment is designed for automated processing of large-format FPC (Flexible Printed Circuit) soft boards, cover films, COF (Chip on Film), CPI (Chip Package on Interposer), and adhesive products used in the automotive industry.
This equipment utilizes a high-precision nanometer-level air-bearing platform, combined with a five-axis galvo optical module and a self-developed laser processing system. It achieves ultra-high precision cutting, drilling, and other processes. The taper
The equipment achieves three-dimensional precision micro machining of various inclined surfaces, conical surfaces, and spherical surfaces through precise control of a multidimensional micro-displacement system.
This system is primarily designed for cutting and opening FPC and PCB boards. It excels in applications such as camera modules and fingerprint recognition.
