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Processing materials

Thin Film Solar Cell Laser Integrated Processing System
The system is used for etching the internal series circuits of perovskite thin film solar cells.
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UV Picosecond Laser Micromachining System
This system is specifically developed for cutting and engraving LCP/MPI/COF/COP/PI/CPI materials and adhesive products.
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Large-format vehicle-mounted FPC/cover film roll-to-sheet processing system
The equipment is designed for automated processing of large-format FPC (Flexible Printed Circuit) soft boards, cover films, COF (Chip on Film), CPI (Chip Package on Interposer), and adhesive products used in the automotive industry.
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Wireless Charging Laser Cutting System
This system uses high-energy green laser to efficiently cut ferrite and other materials used in wireless charging. The cut edges are smooth and burr-free, with no blackening, and the process is highly efficient.
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Small to medium-sized Thin Film Laser Etching System
This system is primarily used for etching silver paste, copper paste conductive coatings, ITO coatings, and nano-silver coatings on PET film or glass substrates.
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UV Nanosecond Laser Cutting System
The equipment is mainly for FPC, PCB sheet cutting, open cover and other processing applications.
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Femtosecond Laser Rotary Precision Machining System
This equipment laser precision microfabrication system is mainly used for thin sheet metal cutting, drilling micro-nano group hole production, drilling, cutting and scribing processing of various materials.
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Laser Fine Processing System
This equipment is a laser cutting, drilling, etching and other forms of processing platform for various materials.
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