UV Nanosecond Laser Cutting System
The equipment is mainly for FPC, PCB sheet cutting, open cover and other processing applications, and in the camera module, fingerprint identification and other applications outstanding performance, can also be mainly including polyimide and other polymer materials, ceramics, quartz, and other non-metallic materials, as well as tungsten copper and other kinds of metal and alloy materials processing.
Inquiry Phone：86-512-6507 0150
E-mail：yj.tao@delphilaser.com■ Specifications：
Equipment Model | FPS15/30 |
Equipment station | Single optical path single station |
Scanning Range | 54mm×54mm（Customizable） |
Processing width | 400mm×300mm（Customizable） |
Positioning accuracy | ±3μm |
Repetition accuracy | ±2μm |
■ Advantages：
◆ High processing efficiency and good working stability
◆ Proven processing technology for various graphic processing
◆ Fine control of laser energy, small heat affected area
◆ Can be equipped with automation system to enhance efficiency
■ Applications:
◆ Processing of FPC and PCB boards such as cutting and uncapping
◆ Camera module cutting
◆ Cutting of fingerprint recognition
◆ Silicon cutting for IGBT, optical communication
◆ Processing of polymer materials such as polyimide, ceramics, quartz, silicon and non-metallic materials
◆ Metal cutting and drilling in the medical field
■ Samples：
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