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Fully Automatic Glass Laser Chamfering System
Model：AGC39
This system is mainly used for solid screen chamfering and special-shaped processing such as LCD, LTPS, and OLED. The system is equipped with automatic image positioning, automatic handling axis, optical inspection (AOI), automatic loading and unloading a
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Laser-Induced Dicing System for Silicon Carbide Wafers
Model：Inducer-5560
Uses ultra-short pulse laser to achieve high quality and high efficient cutting of silicon carbide wafer.
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Automatic Polarizer Laser Cutting Machine
Model：APC60
This system is mainly used for processing polarizers of LCD display. Equipped with automated image positioning, movement axes, and optical inspection (AOI) systems as well as an adjustable motion platform. These sub-systems work together to ensure the sta
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UV Picosecond Laser Micromachining System
Model：DPS21/22
This system is specially developed for cutting and grooving of 5G materials and adhesive products such as LCP/MPI/COF/COP/PI/CPI in the consumer electronics industry with the integration of the high-speed and the high-precision optical processing system.
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Glass Laser Cutting and Breaking System
Model：LGC10/LGC30
Using high-energy infrared picosecond pulsed laser to cut the glass. The device is equipped with the automatic image positioning system and environmental safety system to guarantee the automatic high-speed cutting and drilling of the product. With the ris
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Covering film/vehicle FPC processing Application System
Model：PLD10
This machine is designed for roll-to-sheet and roll-to-roll automatic processing equipment for cover film, COF, CPI and adhesive products, which is equipped with single optical path, double optical path and other systems for high processing accuracy and f
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Laser Repair System for OLED/LCD
Model：
This system is mainly used to repair defects, such as light spot of flexible OLED panels and LCD liquid crystal panel. It can realize different repair functions by replacing different lasers, automatically find the position of the defective spot through t
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Laser-Induced Wafer Dicing System
Model：Inducer-mini800
This device is used to cut Mini LED wafers using stress-induced cutting technology.
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