Silicon Carbide Wafer Laser Processing System
The system is used for laser slicing processing of silicon carbide ingots/pieces. After the laser processing is completed, it is used with an auxiliary dicing device to complete wafer dicing after slicing. The material loss is small, while the processing efficiency is high. No consumables are required to operate the equipment, and the processing cost is low.
Inquiry Phone：+86-512-65070150
E-mail：contact@delphilaser.com■ Advantages
◆ Low material loss
◆ High processing efficiency
◆ No consumables are required to operate the equipment
◆ Low processing cost
■ Applications
Applied to wafer slicing processing of silicon carbide ingots (pieces)
■ Samples
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