EN / CN

Home>Products>Processing method>Laser Cutting

Processing method

HUD Curved Glass Laser Cutting System
Model：LGC71
This system developed through special optical systems and processing software to achieve high-speed and stable cutting of curved glass.
More +

Silicon Carbide Wafer Laser Processing System
Model：DLDS-8680
The system is used for laser slicing processing of silicon carbide ingots/pieces.
More +

UTG Glass Laser Cutting System
Model：LGC52
The system achieves high-speed and stable cutting of UTG through the customized development of a special optical shaping system and processing software.
More +

Fully Automatic Glass Laser Chamfering System
Model：AGC39
This system is mainly used for solid screen chamfering and special-shaped processing such as LCD, LTPS, and OLED.
More +

Laser-Induced Dicing System for Silicon Carbide Wafers
Model：Inducer-5560
Uses ultra-short pulse laser to achieve high quality and high efficient cutting of silicon carbide wafer.
More +

Fully Automatic Laser Polarizers Cutting System
Model：APC60
This system is mainly used for processing polarizers of LCD display.
More +

UV Picosecond Laser Micromachining System
Model：DPS21/22
This System is specially developed for cutting and grooving of 5G materials and adhesive products such as LCP/MPI/COF/COP/PI/CPI.
More +

Laser System for Cover Film/Vehicle FPC
Model：PLD10
The roll-to-sheet and roll-to-roll automatic machining system is specially designed for cover film, COF, CPI and adhesive products.
More +