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Processing method

Glass Laser Cutting and Breaking System
Model：LGC10/LGC30
Using high-energy infrared picosecond pulsed laser to cut the glass.
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Laser-Induced Wafer Dicing System
Model：Inducer-mini800
This device is used to cut Mini LED wafers using stress-induced cutting technology.
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Wireless Charging Field Cutting Application System
Model：FPS21/30
The equipment uses high energy (green light) laser to cut wireless charging materials such as ferrite with high efficiency.
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UV Nanosecond Laser Cutting System
Model：FPS15/30
The equipment is mainly for FPC, PCB sheet cutting, open cover and other processing applications.
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Laser-Induced Dicing System for Glass Wafers
Model：Inducer-5080P
Uses visible or infrared laser for stealth dicing of transparent materials like coated glass and ordinary glass.
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Femtosecond Laser Rotary Precision Machining System
Model：LMS10
This equipment laser precision microfabrication system is mainly used for thin sheet metal cutting, drilling micro-nano group hole production, drilling, cutting and scribing processing of various materials.
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Laser Fine Processing System
Model：AS-5680
This equipment is a laser cutting, drilling, etching and other forms of processing platform for various materials.
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Laser System for Wafer Grooving
Model：AS-5380
The AS-5380 uses a high quality light beam to perform surface scribing and grooving in the wafer dicing channel.
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