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HUD Curved Glass Laser Cutting System
This system developed through special optical systems and processing software to achieve high-speed and stable cutting of curved glass.
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UTG Glass Laser Cutting System
The system achieves high-speed and stable cutting of UTG through the customized development of a special optical shaping system and processing software.
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UV Picosecond Laser Micromachining System
This System is specially developed for cutting and grooving of 5G materials and adhesive products such as LCP/MPI/COF/COP/PI/CPI.
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Laser System for Cover Film/Vehicle FPC
The roll-to-sheet and roll-to-roll automatic machining system is specially designed for cover film, COF, CPI and adhesive products.
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Glass Laser Cutting and Breaking System
Using high-energy infrared picosecond pulsed laser to cut the glass.
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Thin Film Laser Etching System
The equipment is mainly used for etching process of silver paste, copper paste conductive coating, ITO coating and nano silver coating on PET film or glass substrate.
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Wireless Charging Field Cutting Application System
The equipment uses high energy (green light) laser to cut wireless charging materials such as ferrite with high efficiency.
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UV Nanosecond Laser Cutting System
The equipment is mainly for FPC, PCB sheet cutting, open cover and other processing applications.
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