This system is primarily used for cutting and drilling ceramic substrates in high-power electronics modules, aerospace, military electronics, and related products.
The system is mainly used for the rapid processing of through-holes, partial holes, and cavities in LTCC (Low Temperature Co-fired Ceramic) green bodies, ferrites, and other materials.
The processing target is PCBs, suitable for blind and through-hole operations on double-sided copper-clad boards. It can also be equipped with a roll-to-roll mechanism for processing rolled materials.
This system is primarily designed for cutting and opening FPC and PCB boards. It excels in applications such as camera modules and fingerprint recognition.
This system uses high-energy green laser to efficiently cut ferrite and other materials used in wireless charging. The cut edges are smooth and burr-free, with no blackening, and the process is highly efficient.
This system is primarily used for etching silver paste, copper paste conductive coatings, ITO coatings, and nano-silver coatings on PET film or glass substrates.
