Fiber Laser Ceramic Cutting System
This system is primarily used for cutting and drilling ceramic substrates in high-power electronics modules, aerospace, military electronics, and related products.
Inquiry Phone：86-512-6507 0150
E-mail：yj.tao@delphilaser.com■ Specifications：
Model | RPP05 | RPP12 | RPP20 | RPP22 |
Workstation | Dual Optical Path Single Workstation | Single Optical Path Single Workstation | Single Optical Path Dual Workstation | Dual Optical Path Dual Workstation |
Positioning Accuracy | ±3μm | |||
Repeat Accuracy | ±2μm | |||
Drill Hole Diameter | ≥30μm | |||
Cutting Line Width | ≥20μm | |||
Scribing Speed | ≥200mm/s | |||
Cutting Thickness | 2mm | |||
Cutting Speed | ≤40mm/s | |||
Drill Hole Efficiency | >10 hole per second | |||
■ Advantages：
◆ Small beam spot, fine line width
◆ Small heat-affected zone
◆ Image capture of targets, compatible with automatic loading and unloading for automated processing
■ Applications：
◆ LED (packaging) brackets
◆ Passive components
◆ Thick and thin film circuit substrates
◆ Microcrystalline zirconia appearance parts
◆ Metals such as stainless steel
■ Samples：
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