Fiber Laser Ceramic Processing System
The equipment is using infrared pulse laser, its peak power can reach 10 times the average power, high advantages in scribing, cutting, etc.; combined with the optimization of electronic control and optics, so that the fiber optic equipment processed by the material spot small, small line width.
Inquiry Phone：86-512-6507 0150
E-mail：yj.tao@delphilaser.com■ Specifications：
Equipment Model | RPP03 |
Positioning accuracy | ±3μm |
Repetition accuracy | ±2μm |
Minimum borehole diameter | 30μm |
Minimum cutting line width | 20μm |
Maximum scribing speed | 200mm/s |
Maximum cutting thickness | 2mm |
Cutting speed | ≤40mm/s |
Punching efficiency | >10 holes/sec |
■ Advantages：
◆ Small spot, thin line width
◆ Small heat affected area
◆ Stress-free and flexible processing, can process arbitrary shapes
◆ Layered processing with switchable air source
◆ Image capture target for automatic processing
■ Applications：
◆ LED (package) holder
◆ Passive Components
◆ Thick film circuit substrates
◆ Ceramic exterior parts for cell phones, bracelets and other smart terminals
◆ High carbon steel, low carbon steel, stainless steel, aluminum alloy and other metals
■ Samples：
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