Ultra-short Pulse LTCC/HTCC Drilling and Etching System
The equipment is mainly used for fast processing of through-hole, semi-through-hole and cavity of LTCC billets, ferrite and other materials, and also for fine processing such as etching and cutting of various materials.
Inquiry Phone：86-512-6507 0150
E-mail：yj.tao@delphilaser.com■ Specifications：
Applicable materials | LTCC raw ceramic tiles, ferrite materials |
Processing method | Through-hole, semi-through-hole, etching, cutting |
Minimum machining bore diameter | 20μm |
Processing accuracy | ±5μm |
Sheet size | 6" / 8 |
Processing efficiency | 1000~2000 holes/sec |
Loading and unloading method | Fully automatic |
■ Advantages：
◆ Double-headed laser processing equipment, to achieve two sets of oscillating mirror system at the same time ultra-high speed punching, single-headed punching speed of more than 2000 holes / second, punching hole diameter 20μm ~ 40μm continuously adjustable
◆ Fully automatic loading and unloading of equipment, saving labor and improving equipment efficiency
◆ The relative position between the suction cups is adjustable for different sizes of the customer's pieces, thus compatible with different sizes of pieces from 6" to 8".
■ Samples：
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