LTCC/HTCC Laser Drilling and Etching System
The system is mainly used for the rapid processing of through-holes, partial holes, and cavities in LTCC (Low Temperature Co-fired Ceramic) green bodies, ferrites, and other materials.
Inquiry Phone：+86-400 8017 001
E-mail：contact@delphilaser.com■ Specifications：
Materials | LTCC Raw Ceramic, Ferrites |
Processing Method | Through-holes,Semi-through-holes,Etching,Cutting |
Minimum Processing Aperture | 20μm |
Processing Accuracy | ±5μm |
Sheet Size | 6 inch /8 inch |
Processing Efficiency | 4000 hole per second(Duab laser) |
Loading and Unloading Method | Fully automatic |
■ Advantages：
◆ Dual laser processing enables simultaneous high-speed drilling with two sets of galvanometer systems.
◆ Achieve fully automatic loading and unloading to save labor and improve work efficiency.
■ Applications
Applied to LTCC green bodies, ferrites, and similar materials.
■ Samples：
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