UV Picosecond Laser Micromachining System
This system is specifically developed for cutting and engraving LCP/MPI/COF/COP/PI/CPI materials and adhesive products.
Inquiry Phone：86-512-6507 0150
E-mail：yj.tao@delphilaser.com■ Specification:
Model | DPS15 | DPS21 | DPS22 | DPS31 |
Laser | UV Picosecond Laser 15w/30w/40w | |||
Workstation | Single Optical Path Single Workstation
| Single Optical Path Dual Workstation
| Dual Optical Path Dual Workstation
| Single Optical Path Dual Workstation Dual Imaging |
Scanning Range | 54mm×54mm(Customizable) | |||
Processing Area | 550mm×650mm/350mm×500mm(Customizable) | |||
Positioning Accuracy | ±3μm | |||
Repeat Accuracy | ±2μm | |||
Depth Control | ≤±5μm | |||
■ Applications：
◆ LCP, MPI, PTFE, raw porcelain and other materials
◆ PCB, FPC, rigid-flex boards, and other circuit board materials
◆ Processing of PI, CPI, COP, COF, and other thin film materials
◆ AB glue, 3M, TESA, black and white glue, adhesive labels, double-sided tape, easy-tear stickers, ◆ conductive fabric, PE foam tape, PET film, PVC film, anti-static film, blue film, and other adhesive products
◆ Applications involving silicon wafers and other semiconductor materials
■ Samples：
For more information
