UV Picosecond Laser Micromachining System
This system is specially developed for cutting and grooving of 5G materials and adhesive products such as LCP/MPI/COF/COP/PI/CPI in the consumer electronics industry with the integration of the high-speed and the high-precision optical processing system.
Inquiry Phone：86-512-6507 0150
E-mail：yj.tao@delphilaser.com■ Specification:
Module | DPS15 |
Processing Station | Single optical path & single processing station (customizable) |
Scanning area | 54mm×54mm (customizable) |
Working area | 550mm×650mm (customizable) |
Positional accuracy | ±3μm |
Repeated positional accuracy | ±2μm |
Depth control | ≤±5μm |
■ Advantage：
◆ Use self-developed high-power UV picosecond laser to ensure the cost-effective performance.
◆ Effectively controlling of the heat effect and chipping.
◆ Stable and reliable self-developed dual-station processing system to improve efficiency.
◆ Accurate calculation and division of graphic to achieve the effective coordination of processing Specification and graphic.
■ Applications：
◆ Machining of 5G material such as LCP, MPI, PTFE, etc.
◆ Machining of PCB, FPC, rigid-flex board and other circuit board material
◆ Machining of PI, CPI, COP, COF and other thin film
◆ Applicable for AB glue, 3M, TESA, black and white glue, self-adhesive, double-sided adhesive, easy-tear sticker, conductive cloth, PE foam glue, PET film, PVC film, electrostatic film, blue film and other adhesive material.
◆ Applicable for Si and other semiconductor material
■ Samples：
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