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Fully Automatic Laser Polarizers Cutting System
Model：APC60
This system is mainly used for processing polarizers of LCD display.
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UV Picosecond Laser Micromachining System
Model：DPS21/22
This System is specially developed for cutting and grooving of 5G materials and adhesive products such as LCP/MPI/COF/COP/PI/CPI.
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Laser System for Cover Film/Vehicle FPC
Model：PLD10
The roll-to-sheet and roll-to-roll automatic machining system is specially designed for cover film, COF, CPI and adhesive products.
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Glass Laser Cutting and Breaking System
Model：LGC10/LGC30
Using high-energy infrared picosecond pulsed laser to cut the glass.
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Laser Repair System for OLED/LCD
Model：
This system is mainly used to repair defects, such as light spot of flexible OLED panels and LCD liquid crystal panel.
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Laser-Induced Wafer Dicing System
Model：Inducer-mini800
This device is used to cut Mini LED wafers using stress-induced cutting technology.
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Thin Film Laser Etching System
Model：LES07/LES50
The equipment is mainly used for etching process of silver paste, copper paste conductive coating, ITO coating and nano silver coating on PET film or glass substrate.
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Wireless Charging Field Cutting Application System
Model：FPS21/30
The equipment uses high energy (green light) laser to cut wireless charging materials such as ferrite with high efficiency.
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