Micro LED Wafer Laser Lift Off System
The system uses laser lift-off technology to peel off Micro LED wafers.
◆ Lift-off material: Gallium nitride, BCB adhesive, etc.
◆ Processing capacity: 4-6 min/piece@4 inches (converted to UPH: 10-15 pcs)
◆ Size of processed products: 2-8 inch wafer/12 inch substrate
◆ Lift-off method: 1. Laser scanning, injected from the sapphire surface;
2. Point-by-point line scanning via multiple movement modes such as reciprocating polyline or zigzag can be provided
◆ High yield
◆ High efficiency
◆ Full-surface /selective lift-off
Applied to micro-LED wafer lift-off
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