Micro LED Wafer Laser Lift Off System-Semiconductor-Laser Etching Equipment|Wafer Dicing Equipment-Suzhou Delphi Laser Co., Ltd.

Micro LED Wafer Laser Lift Off System

The system uses laser lift-off technology to peel off Micro LED wafers.

■ Specifications:

◆ Lift-off material: Gallium nitride, BCB adhesive, etc.

◆ Processing capacity: 4-6 min/piece@4 inches (converted to UPH: 10-15 pcs)

◆ Size of processed products: 2-8 inch wafer/12 inch substrate

◆ Lift-off method: 1. Laser scanning, injected from the sapphire surface;

2. Point-by-point line scanning via multiple movement modes such as reciprocating polyline or zigzag can be provided

■ Advantages

◆ High yield

◆ High efficiency

◆ Full-surface /selective lift-off

■ Applications

Applied to micro-LED wafer lift-off