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Fully Automatic Laser Polarizers Cutting System
This system is mainly used for processing polarizers of LCD display.
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UV Picosecond Laser Micromachining System
This System is specially developed for cutting and grooving of 5G materials and adhesive products such as LCP/MPI/COF/COP/PI/CPI.
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Laser System for Cover Film/Vehicle FPC
The roll-to-sheet and roll-to-roll automatic machining system is specially designed for cover film, COF, CPI and adhesive products.
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Glass Laser Cutting and Breaking System
Using high-energy infrared picosecond pulsed laser to cut the glass.
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Laser Repair System for OLED/LCD
This system is mainly used to repair defects, such as light spot of flexible OLED panels and LCD liquid crystal panel.
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Laser-Induced Wafer Dicing System
This device is used to cut Mini LED wafers using stress-induced cutting technology.
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Thin Film Laser Etching System
The equipment is mainly used for etching process of silver paste, copper paste conductive coating, ITO coating and nano silver coating on PET film or glass substrate.
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Wireless Charging Field Cutting Application System
The equipment uses high energy (green light) laser to cut wireless charging materials such as ferrite with high efficiency.
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