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UV Nanosecond Laser Cutting System
The equipment is mainly for FPC, PCB sheet cutting, open cover and other processing applications.
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Laser-Induced Dicing System for Glass Wafers
Uses visible or infrared laser for stealth dicing of transparent materials like coated glass and ordinary glass.
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Reel-to-Reel FPC Drilling Application System
The system is used for precision drilling of PCB, the blind hole and through hole of double-sided copper clad laminates.
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Femtosecond Laser Rotary Precision Machining System
This equipment laser precision microfabrication system is mainly used for thin sheet metal cutting, drilling micro-nano group hole production, drilling, cutting and scribing processing of various materials.
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Laser Fine Processing System
This equipment is a laser cutting, drilling, etching and other forms of processing platform for various materials.
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Laser Drilling System for Tempered Glass
This device uses high-energy laser to drill glass efficiently
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Ultra-short Pulse LTCC/HTCC Drilling and Etching System
The equipment is mainly used for fast processing of through-hole, semi-through-hole and cavity of LTCC billets, ferrite and other materials.
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Laser System for Wafer Grooving
The AS-5380 uses a high quality light beam to perform surface scribing and grooving in the wafer dicing channel.
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